Determine the necessary mass, volume, or concentration for preparing a solution.
ベースライン干渉を最小限に抑える必要がある、感度の高いクロマトグラフィーおよび分析ワークフロー向け。
Room temperature に出荷。正確な仕様については、ロット固有の COA をご確認ください。
SDS、COA、データシート、仕様書をダウンロードできます。ロット固有の COA はロット番号検索で入手可能です。
クロマトグラフィー、有機合成、クロスカップリング反応に関する 0 件の査読済み論文で引用されています。
Description:
Bright electroless gold plating solution is formulated as a trouble-free gold plating solution designed to plate gold on metal parts by an electroless immersion process for printed circuit boards, transistor headers, electrical connectors, diode leads, lamps and other electronic parts. This process operates by the electroless displacement of base metals by gold, brought about by a difference in EMF potentials. Bright Electroless Gold is ready to use without modifications and will deposit gold on most common metals and alloys including copper, commercial brass, kovar, nickel, tin-lead solders, pure tin, iron and indium antimonide.Metal parts to be plated should be thoroughly cleaned before use. The normal cleaning procedures for electroplating are adequate.Bright electroless gold plating solution will show a decrease in pH with use. The pH should not be allowed to deviate from the normal conditions for plating since inferior deposits result. Adjustment of pH can be conveniently accomplished by the addition of small amounts of ammonium hydroxide to raise pH or citric acid to lower it.The recommended plating temperature is 90 °C maximum for most metals. However, for tin-lead solders and pure tin, an optimum temperature of 50 °C is recommended.Bright electroless gold plating solution can be used in the fabrication of electrical contacts in electronic devices. It can be used in the activation of aluminum alloy for complementary metal-oxide-semiconductor (CMOS) sensors. It can be electroplated on a polymeric substrate to fabricate ultra-light metallic micro-lattice materials.Gold content: 1/3 troy ounce per gallon.
Features:
1.Economical gold plating;
2.Plates bright gold on copper, kovar, brass, nickel, tin-lead solders and indium antimonide;
3.Excellent solution stability;
4.Operates with simple control of plating solution;
5.Ready-to-use - no mixing required.
危険性、取扱い、保管、および規制遵守を網羅した包括的な文書。
<<<<<<< HEAD SDS をダウンロード → ======= SDS をダウンロード → >>>>>>> release248-p3