Cu/Zn Alloy Powder - ≥99.5% metals basis, ＜200nm

Cat. No.: C299284

GRADE & PURITY ≥99.5% metals basis, ＜200nm

Storage

Room temperature

Shipped In

Normal

Specifications

Specifiche e purezza

≥99.5% metals basis, ＜200nm

Condizioni di conservazione di stoccaggio

Room temperature

Spedito in

Normal

Purezza

≥99.5% metals basis

Application Protocols

Not applicable. No validated bioassay protocols (e.g., WB, IHC, IF, FC) are relevant to a metallic alloy powder.

For materials processing, follow your laboratory’s standard operating procedures for powder metallurgy, brazing, or dealloying. Key variables include particle size distribution, composition, furnace atmosphere, and temperature profile—consult the CoA/SDS and perform small-scale optimization.

Biological Roles

This product is a metallic alloy powder intended for materials science research. It does not have a biological role as supplied.

• General background (literature; not item-specific and not a use claim):

  • Copper and zinc are essential trace elements in biology, occurring in metalloenzymes (e.g., cytochrome c oxidase for Cu; carbonic anhydrase for Zn). Their bioavailability and oxidation states are tightly regulated in vivo.
  • Particulate metal exposure is governed by dissolution, particle size, and surface chemistry; brass corrosion can release Cu2+ and Zn2+ ions in aqueous environments, which can be toxic to aquatic organisms above certain thresholds.

• Laboratory relevance:

  • If the alloy powder is used to fabricate surfaces or devices intended for bioscience experiments (e.g., electrodes for electrochemical biosensing), surface passivation and leach testing are recommended to control ion release.

No clinical or therapeutic applications are implied or supported for this SKU. Use is restricted to research and laboratory development.

Buffer Applications

Not typically applicable. Cu/Zn Alloy Powder is an inorganic metallic solid and does not function as a buffering agent. If suspensions are prepared for processing (e.g., slurries for printing or electrophoretic deposition), the liquid phase may be buffered to control corrosion and dispersion stability, but the alloy itself does not provide buffering capacity.

For chemical processing that involves aqueous environments, choose buffer systems that do not complex copper aggressively (avoid strong ammonia where copper complexation can drive dissolution) and maintain pH to balance corrosion vs passivation.

Green Alternatives

While Cu/Zn alloy powders are inherently metallic and recyclable, greener practice focuses on lifecycle aspects: sourcing, processing energy, atmospheric controls, and solvent/binder systems used in downstream operations. Below is a balanced comparison (general guidance; not item-specific).

• Environmental considerations for brass powders:

  • Positive: High recyclability; potential for closed-loop scrap recovery from machining/sieving fines.
  • Cautions: Fine particulates pose inhalation and aquatic toxicity risks (copper species); sintering and brazing are energy-intensive; acid/alkali dealloying creates metal-bearing effluents.

• Alternatives and process choices:

  • Material substitution: Pure copper (higher conductivity, but similar environmental profile), bronze (Cu–Sn; may avoid Zn leachates), or stainless powders (corrosion resistance but higher embodied energy and alloying complexity).
  • Processing atmosphere: Use optimized nitrogen-based atmospheres with minimal hydrogen while maintaining oxide control; recover and scrub off-gases.
  • Binder systems: Prefer aqueous or bio-based binders/dispersants for tapes/pastes where corrosion can be managed (e.g., pH buffering, corrosion inhibitors); otherwise choose low-VOC carriers.
  • Dealloying/corrosion processes: Replace strong mineral acids with milder organic acids or alkaline etchants where feasible; implement chelant-free treatments and closed-loop wastewater treatment with metal recovery.

• Waste minimization:

  • Employ powder reclamation in AM/PM workflows with sieving and oxygen pick-up tracking.
  • Implement wet-handling to mitigate dust and reduce occupational exposure.

Always perform a process-level assessment (energy, emissions, worker safety) and consult local regulations for metals-containing waste streams.

Pharmaceutical Uses

Not applicable. Cu/Zn Alloy Powder is not used as a pharmaceutical excipient and is supplied strictly for research use only.

• General materials considerations in manufacturing environments (not item-specific):
  • Metallic powders may be used to fabricate tooling, sensors, or fixtures via PM/AM methods for process equipment, but they are not components of drug products.
  • If the alloy is used in non-contact hardware near GMP areas, ensure appropriate containment to prevent particulate contamination and comply with cleaning validation for metal residues.

No pharmacopeial monograph or medicinal use is indicated or claimed for this item.

Physical Properties

Item-specific physical constants are not provided for this SKU.

• Item-specific values:

  • Appearance: Not specified for this item; refer to CoA/Spec Sheet.
  • Particle size (PSD), specific surface area, apparent density, tap density: Not specified for this item; refer to CoA/Spec Sheet.
  • Purity/grade: Not specified for this item; refer to CoA/Spec Sheet.

• Typical properties for Cu–Zn brass powders (literature/general, composition- and PSD-dependent; not item-specific):

  • Density (solid): ~7.3–8.7 g/cm³ depending on Zn content (Cu 8.96 g/cm³; Zn 7.14 g/cm³). Powder apparent density is much lower and PSD-dependent.
  • Melting behavior: Wide range with composition; many brasses melt ~880–1000 °C (solidus–liquidus range varies by alloy). Powders show slightly depressed onset due to surface effects and oxide films.
  • Electrical/thermal conductivity: Decrease with increasing Zn content relative to pure Cu; strongly microstructure-dependent.
  • Magnetic behavior: Diamagnetic/non-magnetic.
  • Solubility: Insoluble in water and organic solvents; reacts with strong acids (especially Zn component) with hydrogen evolution; slowly attacked by alkaline ammonia via complexation of Cu.
  • Surface chemistry: Rapid formation of thin mixed oxides (Cu2O/CuO/ZnO) in air; finer powders oxidize faster.

• Refractive index, logP, pKa: Not applicable to metallic alloys.

Always refer to the product’s CoA for composition, PSD, and any measured physical metrics relevant to your application (sintering, AM feedstock, catalytic precursor).

Quality and Grades

• Item-specific grade/purity: Not specified for this item; refer to CoA/Spec Sheet.

• What to look for in Cu/Zn alloy powders (general guidance for specification and QC; not item-specific):

  • Composition and phase: Reported as wt% Cu/Zn (and any minor elements, e.g., Pb, Sn). Microstructure (α vs α+β) influences flow, sintering, and mechanical properties.
  • Particle size distribution (PSD): D10/D50/D90 or sieve cuts; impacts flowability, packing density, sinter necking, and surface reactivity.
  • Particle morphology: Spherical (gas- or plasma-atomized) vs irregular (mechanically milled); affects flow and apparent density.
  • Oxygen and surface oxide content: Critical for sintering and alloy reactivity; often measured by LECO or TGA reduction.
  • Apparent/tap density and Hall flow rate: Key for powder metallurgy and additive manufacturing.
  • Residuals/trace metals: Fe, Pb, Sn, Ni, Al, etc.; may impact color, conductivity, and corrosion behavior.
  • Surface treatments: Lubricants, anti-caking agents, passivation layers—declare presence/absence.

• Quality implications:

  • High sphericity and narrow PSD improve AM and MIM performance.
  • Lower oxygen enhances liquid-phase sintering and brazing behavior; reducing atmospheres can remediate oxides.
  • Known stabilizers are generally not used for metallic powders; if any organic binder/lube is present, its identity and content should be specified in the CoA.

For this SKU, consult the CoA for exact composition, PSD, oxygen level, and any processing history to ensure suitability for your intended application.

Reaction and Applications

This Cu/Zn Alloy Powder is primarily a materials-science feedstock rather than a molecular reagent. Typical application domains include powder metallurgy, brazing, surface finishing, and as a precursor to nanostructured copper. Below are representative uses and practical notes (general literature guidance; not item-specific):

• Powder metallurgy and sintering:

  • Brass powders are pressed and sintered to produce near-net-shape components. Liquid-phase sintering may occur if a transient liquid forms near the alloy’s liquidus.
  • Process atmospheres: nitrogen, argon, or forming gas (H2/N2) to reduce oxides; dew point control is crucial for reproducible neck growth.

• Brazing and metallization:

  • Brass-based powders/blends serve as brazing fillers for copper and steel when formulated with fluxes; wetting and flow depend on oxide removal and temperature control.

• Catalysis precursor and dealloying:

  • Selective leaching of Zn (acidic or alkaline conditions with oxidants) yields nanoporous copper with high surface area for electrocatalysis (e.g., CO2 reduction) and organic transformations. Residual Zn can tune catalytic selectivity.

• Surface finishing and additive manufacturing:

  • Used in cold spray or binder-jetting routes for decorative and functional parts; particle morphology and PSD dictate spreadability and green density.

Practical tips:

• Dry, low-oxygen handling minimizes oxide films that inhibit sintering and brazing.
• For dealloying, control acid/alkali concentration, temperature, and aeration to balance Zn removal and structural integrity. Post-treat by rinsing and mild reduction to stabilize surfaces.

Note: For any chemical reaction use, validate composition and impurity levels (e.g., Pb, Fe) since they can influence corrosion, conductivity, and catalytic behavior.

Reaction Conditions

Representative processing/reaction conditions for Cu/Zn alloy powders (general literature guidance; not item-specific):

• Powder metallurgy sintering:

  • Atmosphere: N2, Ar, or forming gas (2–10% H2/N2) with low dew point (≤ −40 °C).
  • Temperature: Typically 650–900 °C depending on composition and desired densification; hold 15–60 min at peak in belt or tube furnaces.
  • Notes: Pre-reduction to remove surface oxides improves necking; graphite tooling or getters can tune carbon/oxygen.

• Brazing with brass-based fillers:

  • Temperature: Approx. 850–950 °C (above liquidus of the chosen filler composition).
  • Flux: Borate/fluoride-based for Cu alloys; ensure thorough flux removal post-braze.
  • Joint design: Maintain capillary gaps ~50–150 µm for optimal flow.

• Dealloying to nanoporous Cu:

  • Acid route: Aqueous HCl or H2SO4, ~0.5–2 M, ambient to 60 °C, aerated or with mild oxidant; monitor H2 evolution and dissolve Zn selectively; durations from minutes to hours depending on PSD and target ligament size.
  • Alkaline route: 0.5–2 M NaOH/KOH with dissolved O2 (or peroxide traces) to drive selective Zn removal; thorough rinsing and brief reduction (e.g., H2 at 150–250 °C) stabilizes the porous copper.
  • Safety: Control exotherm and gas evolution; treat effluents to recover Cu/Zn.

• Electroless/galvanic deposition on brass:

  • Use metal salt solutions (Ag+, Au3+) where brass acts as the sacrificial substrate; control pH, complexants, and temperature to moderate displacement kinetics.

Always pilot small-scale trials to tune time, temperature, and atmosphere for your specific powder morphology and composition.

Safety and Handling

• GHS/SDS:

  • Signal word, hazard statements, pictograms, and classification: Not specified for this item; refer to SDS for authoritative information.
  • Research Use Only.

• General hazards for copper/zinc metal powders (literature/industry practice; not item-specific):

  • Inhalation of metal dust may cause respiratory irritation; fine zinc-containing dusts can contribute to metal fume fever if heated to fumes.
  • Powder may present a combustible dust hazard; avoid dust clouds and ignition sources.
  • Reactive with strong acids (Zn dissolves readily with H2 evolution; Cu dissolves in oxidizing acids). Contact with oxidizers can accelerate oxidation.
  • Aquatic toxicity concerns for copper-containing particulates; prevent releases to the environment.

• PPE and engineering controls (good laboratory practice):

  • Use local exhaust ventilation/HEPA capture for weighing and blending.
  • Wear safety glasses, lab coat, and suitable gloves; use a particulate respirator if airborne dust may be generated.
  • Ground/bond equipment; avoid static discharge when handling dry powders.

• First aid (overview; consult SDS):

  • Inhalation: Move to fresh air; seek medical attention for persistent symptoms.
  • Skin/eye contact: Brush off gently; rinse with water. Remove contaminated clothing.
  • Ingestion: Rinse mouth; seek medical advice.

• Storage incompatibilities and special precautions:

  • Store dry at room temperature, tightly closed. Keep away from acids, ammonia, halogens, and strong oxidizers.
  • Minimize dust formation; consider storing under inert atmosphere for long-term stability of fine powders.
  • When heating or sintering, ensure adequate ventilation to avoid exposure to metal fumes and oxides.

Solvent Selection

Not a solvent; this is a metallic powder. However, solvent/environment compatibility matters for slurries, paste formulation, and cleaning.

• General compatibility (literature/industry practice; not item-specific):

  • Water: No dissolution; risk of corrosion/tarnish over time, especially with dissolved oxygen, CO2, chlorides, or ammonia.
  • Acids: Zn component dissolves readily in non-oxidizing mineral acids (HCl, H2SO4) with H2 evolution; Cu dissolves in oxidizing acids (HNO3) and in aerated halide media.
  • Bases: Concentrated ammonia solutions complex Cu; strong alkali alone has limited attack on bulk brass but can facilitate dealloying of Zn in certain conditions.
  • Organic solvents (alcohols, esters, hydrocarbons, glycols): Typically inert; used as carriers for inks/pastes. Avoid halogenated solvents with dissolved oxidants.

• Paste/slurry formulation tips:

  • Use high-boiling, low-water solvents (e.g., glycols, terpenes) with polymeric binders for screen printing; add dispersants to stabilize fine powders.
  • Isopropanol or ethanol can be used for wetting to mitigate dust during handling.

• When to choose Cu/Zn alloy vs alternatives:

  • Brass powders offer desirable color/appearance for decorative coatings and conductive inks with moderate conductivity and improved corrosion resistance vs Zn.
  • Choose pure Cu for maximum conductivity; choose bronze (Cu/Sn) for specific tribological or color properties.

Always verify chemical compatibility with your exact processing medium and consult the CoA for any surface treatments that may influence dispersion.

Storage and Reconstitution

• Storage (item-specific):

  • Store at room temperature (per Product Data). Keep container tightly closed in a dry place. Shipped under normal conditions.

• Best practices (general; not item-specific):

  • Protect from moisture and corrosive atmospheres (acids, ammonia, chlorides). For fine powders or long-term storage, consider inert gas backfill.
  • Minimize handling that generates dust; wet with isopropanol/ethanol for transfers if appropriate to reduce airborne particulates.
  • Segregate from oxidizers and strong acids. Ground/bond containers to avoid static when dispensing.

• Reconstitution/Preparation:

  • Not applicable—solid metallic powder. If preparing slurries or pastes, pre-mix with a compatible solvent/binder under inert or low-oxygen conditions to limit oxidation; use dispersants to achieve target viscosity and stability.

• Shelf life:

  • No specific shelf life is provided. Oxidation/tarnish rate depends on PSD and storage atmosphere. Inspect periodically for caking or color changes indicative of surface oxidation.

Always refer to the product’s SDS for detailed handling guidance and to the CoA/Spec Sheet for any item-specific recommendations (e.g., particle size, oxygen content, and any passivation or surface treatment).

Structure and Identity

Cu/Zn Alloy Powder (commonly referred to as brass powder) is a metallic solid solution of zinc in copper. As an alloy, it does not have a single defined molecular formula or discrete molecular structure.

• Item-specific identifiers:

  • CAS: Not specified for this item; refer to CoA/Spec Sheet.
  • SMILES / InChI / InChIKey: Not applicable to metallic alloys.
  • Molecular formula: Not applicable to alloys with variable composition (Cu–Zn).
  • Molecular weight: Not applicable (bulk metallic alloy).

• Structural features (general, literature):

  • Substitutional alloy where Zn atoms occupy Cu lattice sites.
  • Phase behavior depends on composition and temperature: α-brass (Cu-rich, face-centered cubic), β-brass (body-centered cubic, ordered/disordered at different temperatures), with possible multiphase microstructures near phase boundaries.
  • Typical microstructure comprises grains with phase distribution (α, β, and occasionally γ phases) defined by the Cu:Zn ratio and thermal history (cold-worked vs annealed vs sintered).
  • Surface readily forms thin oxide layers (Cu2O/CuO/ZnO) upon air exposure, especially for fine powders.

• 2D structural description (verbal):

  • Imagine a metallic lattice of close-packed copper atoms; zinc atoms substitute at lattice points, creating a homogeneous solid solution (single phase, α) at lower Zn contents, or a two-phase mixture (α + β) as Zn content increases. Grain boundaries, defects (dislocations, twins), and phase domains govern mechanical and sintering behavior.

Note: Because composition and microstructure define properties, consult the CoA for composition range, particle size distribution, and any processing history for this specific SKU.

Synthetic Utility

From a materials synthesis perspective, Cu/Zn Alloy Powder serves as a versatile precursor and feedstock. Key utilities (general literature; not item-specific):

• Nanoporous copper fabrication by dealloying:

  • Selective removal of Zn from brass (acidic or alkaline oxidizing media) creates bicontinuous nanoporous Cu frameworks with high surface area for electrocatalysis (CO2RR), sensing, and as supports for further functionalization (e.g., galvanic deposition of noble metals).

• Brazing and metallurgical joining:

  • Powdered brass can be blended with fluxes to prepare pastes for joining copper alloys and steels. Alloying with small additions (e.g., Si, Sn) can tailor flow and gap-filling; verify composition via CoA.

• Conductive and decorative coatings:

  • Cold-spray or thermal-spray processes deposit dense brass layers; post-oxidation/patination can generate controlled aesthetics. Electrical resistivity is higher than Cu but may be sufficient for EMI shielding or heater traces.

• Metallothermic and displacement reactions:

  • Powder surfaces participate in galvanic replacement, enabling deposition of metals with higher reduction potentials (e.g., Ag, Au) onto brass, useful for electroless seeding or catalyst preparation.

• Retrosynthetic/materials design role:

  • As a bimetallic starting point, subsequent controlled oxidation (to Cu2O/CuO/ZnO composites) or sulfidation/phosphidation can yield mixed-metal semiconductors with tunable properties.

Practical note: Surface oxides and residuals (e.g., Pb) significantly influence reactivity and downstream properties—consult the CoA and pre-treat (acid dip, reduction) as appropriate.

Target Specificity

Not applicable. This product is a metallic alloy powder and is not a biological reagent or affinity reagent. No antigen/epitope specificity, clone, or isotype information applies.