Flake Boron Nitride - B2O3≤0.1%, used for Thermal Interface Materials Thermally Conductive Engineering Plastics High Thermal Conductivity Aluminum-Based Copper Clad Laminates various applications

Cat. No.: F1525240

GRADE & PURITY B2O3≤0.1%

Storage

Room temperature

Shipped In

Normal

Panoramica

Technical Item	Unit	F1525240-5μm	F1525240-10μm	F1525240-15μm	F1525240-30μm	F1525240-40μm
Particle Size D10	μm	4.13	4.62	5.71	8.33	17.33
Particle Size D50	μm	6.75	9.05	15.57	28.8	44.37
Particle Size D90	μm	14.12	15.98	32.74	71.24	83.95
Specific Surface Area	m²/g	7.8	7	1	0.9	0.7
Electrical Conductivity	μS/cm	35	35	30	20	15
pH Value	-	8	8	8	8	8
Moisture Content	%	0.3	0.3	0.3	0.25	0.25
B₂O₃ Content	%	0.1	0.08	0.08	0.07	0.06

Key Features:

Low Dielectric Constant

High Electrical Insulation

Low Hardness

High Thermal Conductivity

Specifications

Specifiche e purezza

B2O3≤0.1%

Applicazione

Thermal Interface Materials Thermally Conductive Engineering Plastics High Thermal Conductivity Aluminum-Based Copper Clad Laminates

Condizioni di conservazione di stoccaggio

Room temperature

Spedito in

Normal