Amine value: 200~240mgKOH/g for sensitive chromatographic and analytical workflows requiring minimal baseline interference.
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Storage & shipping
Room temperature,Desiccated Ships Normal Check lot-specific COA for exact specifications.
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Quality documents
SDS, COA, datasheet, and spec sheet available for download. Lot-specific COA accessible via lot number lookup.
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Literature proof
Cited in 11 peer-reviewed publications across chromatography, organic synthesis, and cross-coupling reactions.
Panoramica
Low molecular weight polyamide resin is an excellent epoxy resin curing agent formed by the condensation of dimeric vegetable oleic acid and fatty amines.
Features and Applications
The low-molecular-weight polyamide resin contains long aliphatic hydrocarbon chains and polar amide groups in its structure. It enables the cross-linking and curing of epoxy resins at room temperature or under heating, with a widely adjustable mixing ratio and convenient operation. It exhibits excellent adhesion, flexibility, insulation, water resistance, wear resistance, and chemical stability, making it widely used in coatings, packaging, adhesives, the electronics industry, and other fields.
This compound belongs to the class of organic compounds known as strychnos alkaloids. These are alkaloids having a core structure based on the strychnan, stemmadenine (seco-curan), or the akuammicine (curan) skeleton.
External Descriptors
Indole alkaloids
1. Djoumbou Feunang Y, Eisner R, Knox C, Chepelev L, Hastings J, Owen G, Fahy E, Steinbeck C, Subramanian S, Bolton E, Greiner R, and Wishart DS. ClassyFire: Automated Chemical Classification With A Comprehensive, Computable Taxonomy. Journal of Cheminformatics, 2016, 8:61.
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