Electrodeposited copper - Cu ≥ 99.95% , CAS No.7440-50-8

CAS: 7440-50-8 Cat. No.: E1455821 Formule: Cu Poids moléculaire: 63.55 Beilstein Registry Number: MFCD00010965 Numéro CE: 231-159-6

GRADE & PURITY Cu ≥ 99.95%

Storage

Room temperature,Desiccated

Shipped In

Normal

Vue d’ensemble

It is used in electric, light industry, machinery manufacturing, construction industry, national defense industry and other fields.

Specifications

Spécifications et pureté

Cu ≥ 99.95%

Conditions de stockage de stockage

Room temperature,Desiccated

Expédié en

Normal

Noms et identifiants

Sourires canoniques

[Cu]

IUPAC Name

copper

InChIKey

RYGMFSIKBFXOCR-UHFFFAOYSA-N

INCHI

1S/Cu

Isomères SMILES

[Cu]

WGK Allemagne

3

RTECS

GL5325000

Numéro ONU

UN 3189

Groupe d'emballage

II

Poids moléculaire

63.55

Beilstein

MFCD00010965

Taxonomic Classification

Taxonomy Tree

• Kingdom Inorganic compounds
  • Superclass Homogeneous metal compounds
    • Classe Homogeneous transition metal compounds

• Kingdom: Inorganic compounds
• Superclass: Homogeneous metal compounds
• Classe: Homogeneous transition metal compounds
• Subclass: Not available
• Intermediate Tree Nodes: Not available
• Direct Parent: Homogeneous transition metal compounds
• Alternative Parents: Not available
• Molecular Framework: Not available
• Substituents: Homogeneous transition metal
• Description: This compound belongs to the class of inorganic compounds known as homogeneous transition metal compounds. These are inorganic compounds containing only metal atoms,with the largest atom being a transition metal atom.
• External Descriptors: elemental copper

Data sources

1. Djoumbou Feunang Y, Eisner R, Knox C, Chepelev L, Hastings J, Owen G, Fahy E, Steinbeck C, Subramanian S, Bolton E, Greiner R, and Wishart DS. ClassyFire: Automated Chemical Classification With A Comprehensive, Computable Taxonomy. Journal of Cheminformatics, 2016, 8:61.

DOI: 10.1186/s13321-016-0174-y

Propriétés chimiques et physiques

• Point d'ébullition (°C): 2567 °C (lit.)
• Point de fusion (°C): 1083.4 °C (lit.)

Foire aux questions

How should this product be stored?

Store in a cool place, desiccated. Keep the container tightly closed with desiccant — the material is moisture-sensitive.

How is this product shipped?

This product ships under standard ambient conditions. No temperature-controlled packaging is required.

What are the CAS number, molecular formula and molecular weight?

The CAS Number is 7440-50-8, the molecular formula is Cu, and the molecular weight is 63.55 g/mol. InChIKey RYGMFSIKBFXOCR-UHFFFAOYSA-N.

What documentation is provided?

Available product documentation, including Certificates of Analysis (COA), Safety Data Sheets (SDS), and specification sheets, is shown in the product document area. Document availability and access follow the current site policy.