Copper - ≥99.9% metals basis, ≥325 mesh , CAS No.7440-50-8

CAS: 7440-50-8 Cat. No.: C131632 Fórmula: Cu Peso molecular: 63.55 Beilstein Registry Number: MFCD00010965 Número CE: 231-159-6

GRAU & PUREZA ≥99.9% metals basis, ≥325 mesh

Synonyms

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Storage

Room temperature,Argon charged,Desiccated

Shipped In

Normal

Especificações

Sinónimos

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Especificações e pureza

≥99.9% metals basis, ≥325 mesh

Condições de armazenamento de armazenamento

Room temperature,Argon charged,Desiccated

Enviado em

Normal

Pureza

≥99.9% metals basis

Nomes e identificadores

Pubchem Sid

508816919

Pubchem Sid Url

https://pubchem.ncbi.nlm.nih.gov/substance/508816919

SMILES isoméricas

[Cu]

WGK Alemanha

3

RTECS

GL5325000

Número UN

UN 3189

Grupo de embalagem

II

Peso molecular

63.55

Beilstein

MFCD00010965

Propriedades químicas e físicas

• Sensibilidade: Moisture sensitive；Air sensitive
• Ponto de ebulição (°C): 2567 °C (lit.)
• Ponto de fusão (°C): 1083.4 °C (lit.)
• Peso molecular: 63.550 g/mol
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 0
• Rotatable Bond Count: 0
• Exact Mass: 62.9296 Da
• Monoisotopic Mass: 62.9296 Da
• Topological Polar Surface Area: 0.000 Ų
• Heavy Atom Count: 1
• Formal Charge: 0
• Complexity: 0.000
• Isotope Atom Count: 0
• Defined Atom Stereocenter Count: 0
• Undefined Atom Stereocenter Count: 0
• Defined Bond Stereocenter Count: 0
• Undefined Bond Stereocenter Count: 0
• The total count of all stereochemical bonds: 0
• Covalently-Bonded Unit Count: 1

XLogP3