Determine the necessary mass, volume, or concentration for preparing a solution.
para flujos de trabajo cromatográficos y analíticos sensibles que requieren una interferencia mínima de la línea base.
Room temperature Envío . Consulte el COA específico del lote para conocer las especificaciones exactas.
SDS, COA, ficha técnica y hoja de especificaciones disponibles para descargar. COA específico del lote accesible mediante búsqueda por número de lote.
Citado en 0 publicaciones revisadas por pares sobre cromatografía, síntesis orgánica y reacciones de acoplamiento cruzado.
Description:
Bright electroless gold plating solution is formulated as a trouble-free gold plating solution designed to plate gold on metal parts by an electroless immersion process for printed circuit boards, transistor headers, electrical connectors, diode leads, lamps and other electronic parts. This process operates by the electroless displacement of base metals by gold, brought about by a difference in EMF potentials. Bright Electroless Gold is ready to use without modifications and will deposit gold on most common metals and alloys including copper, commercial brass, kovar, nickel, tin-lead solders, pure tin, iron and indium antimonide.Metal parts to be plated should be thoroughly cleaned before use. The normal cleaning procedures for electroplating are adequate.Bright electroless gold plating solution will show a decrease in pH with use. The pH should not be allowed to deviate from the normal conditions for plating since inferior deposits result. Adjustment of pH can be conveniently accomplished by the addition of small amounts of ammonium hydroxide to raise pH or citric acid to lower it.The recommended plating temperature is 90 °C maximum for most metals. However, for tin-lead solders and pure tin, an optimum temperature of 50 °C is recommended.Bright electroless gold plating solution can be used in the fabrication of electrical contacts in electronic devices. It can be used in the activation of aluminum alloy for complementary metal-oxide-semiconductor (CMOS) sensors. It can be electroplated on a polymeric substrate to fabricate ultra-light metallic micro-lattice materials.Gold content: 1/3 troy ounce per gallon.
Features:
1.Economical gold plating;
2.Plates bright gold on copper, kovar, brass, nickel, tin-lead solders and indium antimonide;
3.Excellent solution stability;
4.Operates with simple control of plating solution;
5.Ready-to-use - no mixing required.
Documento completo sobre peligros, manipulación, almacenamiento y cumplimiento normativo.
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