10 g clip-pack for sensitive chromatographic and analytical workflows requiring minimal baseline interference.
Room temperature Ships Check lot-specific COA for exact specifications.
SDS, COA, datasheet, and spec sheet available for download. Lot-specific COA accessible via lot number lookup.
Cited in 0 peer-reviewed publications across chromatography, organic synthesis, and cross-coupling reactions.
Description
2-part, 10:1 mix, translucent encapsulant with high tear strength. Dow Corning®silicone encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.SYLGARD®186, a high tensile strength two-part silicone system, can be used in the formation of elastic substrates for potential usage in flexible electronics. It can be used in the fabrication of microcable neuroelectrodes for biomedical micro-electromechanical systems (MEMS).Preweighed monomer and curing agent in convenient blister packs. SYLGARD®186 Silicone Elastomer Kit is comprised of base/curing agent to be mixed in a 10 (base): 1 (curing agent) ratio by weight for manual mixing.Potential Uses:General potting applications.Power supplies.Connectors.Sensors.Industrial controls.Transformers.Amplifiers.High voltage resistor packs.Relays.Adhesive/encapsulant for solar cells.Adhesive handling beam lead integrated circuits during processing.Working time at 25 °C (pot life hours): 1.65 hr.Heat cure time at 100 °C: 25 minutes.Heat cure time at 125 °C: 15 minutes.Heat cure time at 150 °C: 15 minutes.
Preparation instructions
Mixing And De-Airing - Dow silicone encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical and PCB system assembly applications. The 10:1 mix ratio gives one latitude to tune the modulus and hardness for specific application needs and production lines. Dow silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.Preparing Surfaces - In applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide for the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.
Comprehensive hazard, handling, storage, and regulatory compliance document.
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