Copper - ≥99.5% metals basis, 10-15μm , CAS No.7440-50-8

CAS: 7440-50-8 Cat. No.: C501362 분자식: Cu 분자량: 63.55 Beilstein Registry Number: MFCD00010965 EC 번호: 231-159-6

GRADE & PURITY ≥99.5% metals basis, 10-15μm

Synonyms

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Storage

Room temperature,Argon charged,Desiccated

Shipped In

Normal

Specifications

동의어

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

사양 및 순도

≥99.5% metals basis, 10-15μm

보관 조건

Room temperature,Argon charged,Desiccated

배송

Normal

순수함

≥99.5% metals basis

이름과 식별자

• Pubchem Sid: 504753157
• Pubchem Sid Url: https://pubchem.ncbi.nlm.nih.gov/substance/504753157
• 이성체 SMILES: [Cu]
• WGK 독일: 3
• RTECS: GL5325000
• UN 번호: UN 3189
• 포장 그룹: II
• 분자량: 63.55
• Beilstein: MFCD00010965

화학 및 물리적 특성

• 끓는점(°C): 2567 °C (lit.)
• 녹는점(°C): 1083.4 °C (lit.)
• 분자량: 63.550 g/mol
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 0
• Rotatable Bond Count: 0
• Exact Mass: 62.9296 Da
• Monoisotopic Mass: 62.9296 Da
• Topological Polar Surface Area: 0.000 Ų
• Heavy Atom Count: 1
• Formal Charge: 0
• Complexity: 0.000
• Isotope Atom Count: 0
• Defined Atom Stereocenter Count: 0
• Undefined Atom Stereocenter Count: 0
• Defined Bond Stereocenter Count: 0
• Undefined Bond Stereocenter Count: 0
• The total count of all stereochemical bonds: 0
• Covalently-Bonded Unit Count: 1

XLogP3

Application Protocols

No application protocols are item-specific in the Product Data. For general guidance, consult literature procedures relevant to your intended transformation (e.g., CuAAC, Ullmann coupling, Glaser–Hay coupling) and optimize copper activation, ligand, base, and solvent according to substrate class. Not specified for this item; refer to CoA/Spec Sheet and SDS for handling-specific steps.

Biological Roles

This section provides general biochemical context for elemental copper; it does not imply any biological or clinical use of this product.

• Essential trace element (literature): Copper is required for numerous metalloenzymes, including cytochrome c oxidase (electron transport), Cu/Zn-superoxide dismutase (antioxidant defense), lysyl oxidase (connective tissue crosslinking), dopamine β-hydroxylase (neurotransmitter biosynthesis), and tyrosinase (melanin biosynthesis).
• Redox cycling (literature): Interconversion between Cu(I) and Cu(II) underlies catalytic roles in electron transfer and reactive oxygen species modulation. Cellular handling uses chaperones (e.g., ATOX1, CCS) to deliver copper to specific targets while minimizing free-ion toxicity.
• Homeostasis (literature): Uptake via CTR1; export via ATP7A/ATP7B maintains intracellular balance. Metallothioneins buffer excess copper to prevent Fenton-like chemistry.
• Structural roles (literature): Copper centers in enzymes provide unique coordination environments (e.g., type 1 blue copper proteins) that fine-tune redox potential and electron transfer kinetics.

Note: Biological roles pertain to ionic/covalent copper in biomolecules rather than bulk metallic copper. This product is supplied for research use only.

Buffer Applications

Not typically applicable. Elemental copper is a metallic solid and not used to prepare pH buffer systems. If copper is employed in biochemical experiments, it is usually introduced as soluble copper salts at trace levels or as catalysts; consult substrate- and assay-specific literature for compatible buffer systems and copper speciation control.

Green Alternatives

Copper often enables more sustainable alternatives to precious-metal catalysis when used catalytically and under benign conditions.

• Greener strategy highlights (literature):
  • Replace stoichiometric copper with catalytic loadings (≤1–10 mol%) and a suitable ligand to minimize metal waste in C–N/C–O couplings.
  • Use mixed aqueous–bio-derived solvents (e.g., t-BuOH/H₂O, ethanol/water) for CuAAC and Glaser couplings; avoid chlorinated solvents.
  • Employ oxygen (air) as the terminal oxidant for oxidative couplings rather than peroxides or hypervalent iodine reagents.

Comparison snapshot (literature):

• CuAAC vs RuAAC/Pd-catalyzed alternatives:
  • Copper catalysis proceeds at room temperature in water-rich media with high regioselectivity (1,4-triazoles) and generally lower EHS footprint than many noble-metal systems.
• Copper-catalyzed Ullmann variants vs Pd Buchwald–Hartwig:
  • Copper may allow lower-cost, lower-PGM routes and is often tolerant of greener solvents (ethanol, water with surfactants), but may require stronger bases or longer times.

Trade-offs:

• Copper leaching into products must be controlled (work-up with chelators like EDTA; solid-supported copper can aid removal).
• Air management: some copper reactions need O₂ (Glaser) while others are air-sensitive (CuAAC with reducing agents). Balance green metrics with selectivity and safety.

Pharmaceutical Uses

Copper metal itself is not commonly used as a pharmacopeial excipient. In pharmaceutical and device research contexts (general information):

• Process/Manufacturing: Copper tooling and surfaces may be used in equipment or catalysis research; any potential leachables must be controlled per GMP and ICH guidelines.
• Catalysis in API synthesis: Copper catalysts (often salts or nanoparticles) are widely used at the process R&D stage for C–N/C–O bond formation and azide–alkyne cycloadditions; stringent downstream purification is required to meet residual metal limits.
• Diagnostics/Materials research: Copper foils and thin films are used as substrates for CVD graphene growth and other advanced materials relevant to medical device R&D.

No therapeutic or clinical claims are made for this product. For any regulated use, validate residual metal, particulates, and extractables per applicable standards.

Physical Properties

The following are typical literature values for elemental copper; they are not product specifications.

• Physical state/appearance: Reddish metallic solid (literature)
• Crystal structure: Face-centered cubic (fcc) (literature)
• Melting point: ~1084.62 °C (literature)
• Boiling point: ~2562 °C (literature)
• Density: ~8.96 g·cm⁻³ at 20 °C (literature)
• Electrical resistivity: ~1.68 × 10⁻⁸ Ω·m at 20 °C (literature)
• Thermal conductivity: ~401 W·m⁻¹·K⁻¹ (literature)
• Solubility: Insoluble in water; dissolves in oxidizing acids (e.g., HNO₃) and hot concentrated H₂SO₄ with evolution of NOx/SO₂ (literature)
• Surface chemistry: Readily forms thin Cu₂O/CuO layers in air; oxide can be removed by mild acid or ligand activation (literature)
• Magnetic behavior: Diamagnetic (literature)
• Refractive index: Not applicable for bulk opaque metal
• pKa/logP: Not applicable to elemental copper

Item-specific numerical specifications (e.g., trace metals, surface area, particle size) are not provided in the Product Data. Not specified for this item; refer to CoA/Spec Sheet.

Quality and Grades

• Item-specific grade/purity: Not specified for this item; refer to CoA/Spec Sheet.
• Practical considerations for elemental copper quality (general guidance):
  • Purity levels (e.g., 99%, 99.9%, 99.99%) impact trace-metal content that can profoundly affect catalytic performance (poisoning or promotion) and electronic applications.
  • Physical form (wire, foil, granules, turnings, powder) governs surface area and reactivity; powders typically show higher activity but require more stringent inert/dry handling.
  • Surface condition is crucial. Native oxides inhibit many catalytic and coupling roles; pretreatments (acid wash, ligand activation, or reductive conditioning) are often required.
• Stabilizers/additives: None indicated for this item. If passivated or coated forms are supplied, details would appear on the CoA/specification sheet.
• Analytical verification:
  • Typical characterization can include ICP-OES/ICP-MS for trace elements, BET or laser diffraction for powders, XPS or Auger for surface oxidation state, and XRD for phase purity (literature methods). Consult the product CoA for the tests performed on this lot.

Reaction and Applications

Elemental copper is widely used as a reagent, catalyst, and catalyst precursor. Key application areas (literature):

• Copper-catalyzed azide–alkyne cycloaddition (CuAAC):
  • Cu(0) (wire, powder) can reduce Cu(II) to catalytically active Cu(I) in situ with a reducing agent (e.g., sodium ascorbate) in t-BuOH/H₂O, yielding 1,4-disubstituted 1,2,3-triazoles efficiently at ambient temperature.
• Ullmann-type couplings:
  • Stoichiometric or catalytic copper (often as activated powder) couples aryl halides with nucleophiles (O-, N-, S-coupling). Modern variants use ligands (e.g., diamines, amino acids) to lower temperature and loading; classical protocols employed Cu powder at elevated temperatures.
• Glaser–Hay oxidative alkyne coupling:
  • Terminal alkynes undergo oxidative homocoupling to 1,3-diynes using copper and an amine base under O₂/air; Cu(0) can serve as initiator/precatalyst.
• Dehalogenation and reductive transformations:
  • Activated copper removes halogens from organohalides (e.g., debromination of vic-dibromides) under reductive conditions; copper bronze is traditional for certain reductions.
• Halogen–lithium exchange quench scavenging:
  • Copper metal surfaces can scavenge halogens and serve as sinks for adventitious oxidants in organometallic setups.
• Heterogeneous catalysis/support:
  • Copper surfaces or deposited copper nanoparticles catalyze hydrogenations/dehydrogenations, borylations, and click reactions; activity depends strongly on surface cleanliness and oxide coverage.

Practical tips:

• Activate copper by brief acid wash (e.g., dilute HCl), rinse, and immediate transfer to dry, oxygen-free media; or precondition with iodine or ligand (IMes, diamines) depending on protocol.
• Maintain inert atmosphere for reduction-sensitive steps; oxygen is required for oxidative couplings like Glaser.
• Particle size and stirring strongly influence rates; avoid excessive oxide reformation.

Reaction Conditions

Representative literature conditions where elemental copper (wire, powder, or turnings) is used directly or as a precatalyst; adapt to substrate and scale.

• CuAAC (copper wire or powder as Cu(I) source):
  • Solvent: t-BuOH/H₂O (1:1) or H₂O/EtOH; Base: optional; Reductant: sodium ascorbate (0.5–1.0 equiv vs Cu source) to maintain Cu(I).
  • Temperature: 20–40 °C; Atmosphere: inert recommended to minimize Cu(I) oxidation; Time: 0.5–12 h depending on substrate.
• Ullmann-type C–N/C–O couplings with Cu(0):
  • Solvent: DMSO, DMF, DMAc, dioxane, or toluene; Base: K₂CO₃, Cs₂CO₃, or t-BuOK; Ligands: diamines (e.g., N,N′-dimethylethylenediamine), amino acids.
  • Temperature: 80–140 °C for ligand-accelerated variants; classical protocols with bare Cu powder may require 160–220 °C.
  • Atmosphere: inert; Time: 6–24 h+ depending on aryl halide activation.
• Glaser–Hay alkyne coupling (initiated by Cu):
  • Solvent: Pyridine, Et₃N, or toluene with amine base (TMEDA/Et₃N); Oxidant: O₂/air (bubbled or open system).
  • Temperature: 20–60 °C; Atmosphere: oxygenated; Time: 2–16 h.

Operational tips (literature):

• Pre-treat copper with dilute HCl, rinse with solvent, dry under inert, and use immediately.
• Agitation and exposed copper surface area are rate-limiting—use fine powder or increase surface via turnings/mesh where safe.
• Control copper residues in products by aqueous EDTA washes or adsorption on silica/thiol resins.

Safety and Handling

• GHS/SDS: Item-specific GHS signal word, hazard statements, and pictograms are not provided here. Not specified for this item; refer to CoA/Spec Sheet and the product SDS for authoritative information.
• General hazards (literature):
  • Massive solid copper is generally of low acute hazard, but dusts/fines can be irritant to eyes/respiratory tract and may pose combustible dust risks under certain conditions.
  • Copper compounds and soluble copper species are toxic to aquatic organisms; avoid environmental release.
• PPE and engineering controls:
  • Wear safety glasses, lab coat, and appropriate gloves. Use local exhaust ventilation when generating dust or when acid/oxidizing treatments are performed to activate the surface.
• Incompatibilities and reactivity (literature):
  • Avoid contact with strong oxidizers, halogens, and ammonia solutions in the presence of air (risk of complexation/corrosion). Copper reacts with oxidizing acids (e.g., HNO₃) releasing NOx; ensure scrubbing/ventilation.
  • Copper catalyzes peroxide decomposition; avoid storing peroxide-forming solvents over copper surfaces.
• First aid (overview; consult SDS):
  • Eye/skin contact with dust: Rinse with water; remove contaminated clothing. Inhalation of dust: Move to fresh air. Ingestion: Rinse mouth. Seek medical attention as needed.
• Fire safety: Copper itself is not readily combustible; fine powders may present a dust explosion risk in air—prevent dust clouds and ignition sources.

Solvent Selection

This product is a metallic solid and not a solvent; solvent selection is not directly applicable.

• For reactions employing copper as a catalyst or reagent, choose solvent systems compatible with the intended transformation (see Reaction Conditions). Common media (literature) include:
  • Polar protic/aprotic mixtures (t-BuOH/H₂O) for CuAAC when Cu(I) is generated in situ.
  • Amine bases/solvents (e.g., pyridine, ethylenediamine, TMEDA) for Ullmann- and Glaser-type couplings.
  • Amide or ether solvents (DMSO, DMAc, NMP, dioxane) in modern ligand-accelerated copper couplings. Select solvents considering substrate solubility, base, oxygen requirements (for oxidative couplings), and sustainability (see Green Alternatives).

Storage and Reconstitution

• Item-specific storage conditions (from Product Data): Room temperature; Argon charged; Desiccated; Cool. Shipped at ambient (Normal).
• Rationale and best practices:
  • Keep container tightly closed under inert gas (Ar/N₂) to minimize surface oxidation/tarnish and moisture uptake that can passivate catalytic surfaces.
  • Store in a dry place with desiccant. Avoid proximity to acids, oxidizers, halogens, and ammonia-containing atmospheres.
  • For powders, minimize handling in ambient air; reseal promptly. If oxide forms, reactivate prior to use (e.g., brief dilute acid wash, solvent rinse, immediate transfer under inert).
• Reconstitution: Not applicable; elemental copper is supplied ready-to-use as a solid. If a slurry or packed bed is desired for flow or heterogeneous catalysis, prepare under inert conditions in anhydrous solvent.
• Shelf life: Not specified for this item; refer to CoA/Spec Sheet. Periodic verification of activity may be warranted for high-surface-area forms due to surface oxidation over time.
• Research Use: For research use only (as stated in Product Data).

Structure and Identity

Elemental copper is a zero-valent transition metal (Group 11) presented as Cu(0). It is monatomic in the condensed phase with a face-centered cubic (fcc) metallic lattice.

• Item-specific identifiers (from Product Data):
  • SKU: C501362
  • Product name: Copper
  • CAS: 7440-50-8
  • PubChem CID: 23978
  • Storage notes: Room temperature, Argon charged, Desiccated, Cool (item-specific)
• InChIKey: Not specified for this item; refer to CoA/Spec Sheet.
• SMILES: [Cu] (literature; elemental atom notation)
• Molecular formula: Cu (literature for elemental copper)
• Molecular weight (standard atomic weight): 63.546 g/mol (literature; IUPAC)

Structural features (descriptive, literature):

• Zero-valent metallic copper with an fcc lattice (a ≈ 3.615 Å) and delocalized conduction electrons.
• Common surface oxidation states on exposure to air: transient Cu(I)/Cu(II) oxides as thin passivation layers (chemically removable/activatable).
• In 2D depiction, copper is represented as a single “Cu” atom; no covalent bonds or functional groups are inherent to the element.

Synthetic Utility

From a retrosynthetic and mechanistic viewpoint, copper metal serves as a source/sink of electrons and as a precursor to surface-bound Cu(I)/Cu(II) catalytic species.

• Functional group interconversions (literature):
  • Aryl–heteroatom bond construction via Ullmann-type couplings (Ar–X to Ar–O/Ar–N/Ar–S) using Cu(0)/Cu(I) manifolds.
  • Azide–alkyne 1,3-dipolar cycloadditions to 1,4-triazoles (CuAAC) with Cu(I) generated from Cu(0) under reducing conditions.
  • Oxidative homocoupling of terminal alkynes (Glaser–Hay) to diynes with O₂ as oxidant.
• Reductive roles (literature):
  • Dehalogenation of vic-dihalides and allylic/benzylic halides under copper-activating, reducing conditions.
  • Promoter in borylation and silylation reactions where surface Cu(I)–B/Si intermediates participate.
• Scavenging/purification (literature):
  • Copper turnings/wire employed to remove residual halogens or sulfur species from reaction mixtures or gases.

Strategic notes:

• Surface preparation is paramount—oxide-free, high-area copper markedly improves kinetics. Activation via dilute mineral acid, iodine, or chelating ligands is common.
• Ligand choice (diamines, amino acids, NHCs) can tune reactivity and selectivity, enabling catalytic rather than stoichiometric copper usage.
• Consider heterogeneous setups (fixed-bed or copper-packed microreactors) for flow chemistry and simplified metal removal.

Target Specificity

Not applicable. This product is elemental copper, not a biological affinity reagent or antibody. No antigen/epitope specificity, clone, or isotype information applies.