Nano Titanium oxide - electronic grade, ≥99.8% metals basis, 300-700nm , CAS No.13463-67-7

CAS: 13463-67-7 Cat. No.: N1519826 Formula: TiO2 Molecular Weight: 79.87 EC Number: 236-675-5
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GRADE & PURITY Electronic grade ? Electronic grade — ultra-low metallic and particulate impurities for microelectronics. Use in semiconductor and electronics processes intolerant of contamination. ≥99.8% metals basis 300-700nm
Storage
Room temperature
Shipped In
Normal
Price
€58.05
AVAILABLE TO ORDER

Specifications

Specifications & Purity
electronic grade, ≥99.8% metals basis, 300-700nm
Storage
Room temperature
Shipped In
Normal
Grade
Electronic grade
Purity
≥99.8% metals basis
Names and Identifiers
Canonical Smiles
O=[Ti]=O
IUPAC Name
dioxotitanium
InChIKey
GWEVSGVZZGPLCZ-UHFFFAOYSA-N
INCHI
1S/2O.Ti
Isomeric SMILES
O=[Ti]=O
Molecular Weight
79.87

Documentation

📋 Safety Data Sheet (SDS)

Comprehensive hazard, handling, storage, and regulatory compliance document.

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✅ Certificate of Analysis (COA)

Lot-specific quality data. Enter your lot number to retrieve the exact COA.

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📊 Datasheet

Quick-reference summary of product specifications and applications.

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🔬 Specification Sheet

Full quality attributes and acceptance criteria for this grade.

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Advanced Data

Taxonomic Classification

Taxonomy Tree

KingdomInorganic compounds
SuperclassMixed metal/non-metal compounds
ClassTransition metal organides
SubclassTransition metal oxides
Intermediate Tree Nodes Not available
Direct ParentTransition metal oxides
Alternative Parents Inorganic salts  Inorganic oxides  
Molecular FrameworkNot available
Substituents Transition metal oxide - Inorganic oxide - Inorganic salt
DescriptionThis compound belongs to the class of inorganic compounds known as transition metal oxides. These are inorganic compounds containing an oxygen atom of an oxidation state of -2, in which the heaviest atom bonded to the oxygen is a transition metal.
External Descriptors titanium molecular entity
3D Structure
Interactive Chemical Structure Model





Certificates(CoA,COO,BSE/TSE and Analysis Chart)
C of A & Other Certificates(BSE/TSE, COO):
Analytical Chart:
Chemical and Physical Properties
SensitivityHygroscopic
Boil Point(°C)2900 °C/1013 hPa
Melt Point(°C)1855 °C
Molecular Weight79.866 g/mol
XLogP3
Hydrogen Bond Donor Count0
Hydrogen Bond Acceptor Count2
Rotatable Bond Count0
Exact Mass79.9378 Da
Monoisotopic Mass79.9378 Da
Topological Polar Surface Area34.100 Ų
Heavy Atom Count3
Formal Charge0
Complexity18.300
Isotope Atom Count0
Defined Atom Stereocenter Count0
Undefined Atom Stereocenter Count0
Defined Bond Stereocenter Count0
Undefined Bond Stereocenter Count0
The total count of all stereochemical bonds0
Covalently-Bonded Unit Count1
Documents & Articles
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Structure–Property Relationship of Silicone Resins: Mechanisms of Heat Resistance, Weatherability, Hydrophobicity, and Coating Performance Analysis
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PVAc, VAE, and Vinyl Acetate-Based Emulsions: Film-Forming Logic and Performance Boundaries in Architectural Coatings
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How Should Montmorillonite Be Rationally Modified? Organic Modification, Inorganic Modification, and Application-Oriented Selection and Validation
Epoxy Phenolic Coatings: Why Are They Commonly Used for Chemical Resistance, Solvent Resistance, Heat Resistance, and Internal Metal Surface Protection?
Selection and Formulation Design Guidelines for Phenolic Resins in Coatings: Applicable Scenarios, Application Limitations, and Performance Verification
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Applications and Selection of Polyester Resins in Industrial Coatings: Powder, Coil, Baking, Packaging, and Metal Coating Scenarios
How to Select Vinyl-Related Resins: Building Formulation Judgment Based on Substrate, Performance Targets, and Failure Risks
Applicability Boundaries, Failure Risks, and Alternative System Selection for Chlorinated Rubber Resin in Coatings
Waterborne Resin Application Guide: Formulation Synergy, Troubleshooting, and Technology Development Trends
Mechanisms and Control of Coating Yellowing: From Chromophoric Structure Formation to Source Diagnosis and Formulation Optimization
Resin Polarity in Coating Formulations: From Molecular Structure to Dissolution, Compatibility, Interfacial Interactions, and Formulation Design
Why Do Daily Chemical Products Become Opaque? Formation Mechanisms of Milky Turbidity, Pearlescence, and Coverage, and How to Select the Right Ingredients
Color-Development Mechanisms, Formulation Forms, and Selection/Application Logic of Colorants in Personal Care Products
Analysis of the Production Process of Hydroxypropyl Methylcellulose (HPMC) for Putty: Understanding Differences in Substitution Structure and Gelation Temperature from High-Ratio and Low-Ratio Formulations
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Influencing Factors and Control Strategies for Blistering in Neutral Wall Putty: An Experimental Analysis Based on HPMC Dosage, Viscosity, and Ground Calcium Carbonate Fineness
How to Select Binding/Gel Materials for Neutral Wall Putty? A Comparison of Pregelatinized Starch, PVA, and Redispersible Polymer Powder Based on Four Application Trials
Causes and Mechanism Analysis of Delamination During Sanding of Water-Resistant Putty
What Are the Differences Between Polyvinyl Alcohol 1788, 2488, and 2699? Understanding Workability, Bonding Strength, and Relative Water Resistance from the Perspective of Degree of Polymerization and Degree of Hydrolysis
Differences and Application Selection of Cassava- and Corn-Based Pregelatinized Starch in Neutral Putty Formulations
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Mechanism of Kojic Acid in Reducing Hyperpigmentation: From Tyrosinase Inhibition to Melanin Production Regulation
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Mechanism of Action of Tranexamic Acid in Pigmentation Care: From the Plasmin System to Regulation of Inflammation-Driven Pro-Melanogenic Signaling
Citations of This Product
Solution Calculators
Reviews

Customer Reviews

Frequently Asked Questions

What does the trace-metals specification mean?
This product is specified at ≥99.8% on a trace-metals basis. That figure describes metallic impurity content rather than overall chemical assay, so it is the relevant specification for ICP-MS, semiconductor and battery applications. Lot-specific values are stated on the Certificate of Analysis.
What does electronic grade mean?
electronic grade indicates that the material has been processed and tested for semiconductor and electronics manufacturing. Specifications focus on the impurities that affect performance in that application — for example, metal content for electronics, particle size for batteries, refractive index for optics, or moisture content for moisture-sensitive processes.
How should this product be stored?
Store in a cool place.
How is this product shipped?
This product ships under standard ambient conditions. No temperature-controlled packaging is required.
What are the CAS number, molecular formula and molecular weight?
The CAS Number is 13463-67-7, the molecular formula is TiO2, and the molecular weight is 79.87 g/mol. InChIKey GWEVSGVZZGPLCZ-UHFFFAOYSA-N.
What documentation is provided?
Available product documentation, including Certificates of Analysis (COA), Safety Data Sheets (SDS), and specification sheets, is shown in the product document area. Document availability and access follow the current site policy.

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