4,4'-Diaminodiphenyl Sulfone（DDS） - Moligand™, ≥99.5%, used for Tetrafunctional epoxy resin can be mixed with DDS and can be heat cured for oilfield applications. DDS can also be used to cure layered double hydroxide based epoxy resins of iron oxide (Fe2O

CAS: 80-08-0 Cat. No.: D1507143 Summenformel: C₁₂H₁₂N₂O₂S Molekulargewicht: 248.3 Beilstein Registry Number: 788055 EG-Nummer: 201-248-4

QUALITÄT & REINHEIT Moligand™, ≥99.5%

Synonyms

Bis(4-aminophenyl) sulfone | 4-Aminophenyl sulfone | 4,4'-Sulfonyldianiline | 4,4'-Diaminodiphenyl Sulfone

Storage

Store at 2-8°C,Protected from light

Shipped In

Wet ice

Übersicht

4-Aminobenzenesulfone (DDS) is a diamine curing agent used for curing epoxy resins.

Product application:

Product application: Tetrafunctional epoxy resin can be mixed with DDS and can be heat cured for oilfield applications. DDS can also be used to cure layered double hydroxide based epoxy resins of iron oxide (Fe2O3), forming flame-retardant epoxy resin nanocomposites. It can also be used as a curing agent to cure bisphenol A (DGEBA) used in the manufacture of flame-retardant epoxy resin/clay nanocomposites.

Spezifikationen

Synonyme

Bis(4-aminophenyl) sulfone | 4-Aminophenyl sulfone | 4,4'-Sulfonyldianiline | 4,4'-Diaminodiphenyl Sulfone

Spezifikationen & Reinheit

Moligand™, ≥99.5%

Anmeldung

Tetrafunctional epoxy resin can be mixed with DDS and can be heat cured for oilfield applications. DDS can also be used to cure layered double hydroxide based epoxy resins of iron oxide (Fe2O3), forming flame-retardant epoxy resin nanocomposites. It can a

Storage

Store at 2-8°C,Protected from light

Verschickt in

Wet ice

Dieses Produkt erfordert Kühlkettenversand. Grundversand und andere Economy-Optionen sind nicht verfügbar.

Note

Moligand™

Reinheit

≥99.5%

Produkteigenschaften

ALogP

1

Namen und Kennungen

Kanonisches Lächeln

NC1=CC=C(C=C1)S(=O)(=O)C1=CC=C(N)C=C1

IUPAC Name

4,4'-Sulfonyldianiline

InChIKey

MQJKPEGWNLWLTK-UHFFFAOYSA-N

INCHI

InChI=1S/C12H12N2O2S/c13-9-1-5-11(6-2-9)17(15,16)12-7-3-10(14)4-8-12/h1-8H,13-14H2

Isomere SMILES

C1=CC(=CC=C1N)S(=O)(=O)C2=CC=C(C=C2)N

WGK Deutschland

1

RTECS

BY8925000

Molekulargewicht

248.3

Beilstein

788055

Reaxy-Rn

788055

Reaxys-RN_link_address

https://www.reaxys.com/reaxys/secured/hopinto.do?context=S&query=IDE.XRN=788055&ln=

Taxonomic Classification

Taxonomy Tree

• Kingdom Organic compounds
  • Superclass Benzenoids
    • Klasse Benzene and substituted derivatives
      • Subclass Benzenesulfonyl compounds

• Kingdom: Organic compounds
• Superclass: Benzenoids
• Klasse: Benzene and substituted derivatives
• Subclass: Benzenesulfonyl compounds
• Intermediate Tree Nodes: Not available
• Direct Parent: Benzenesulfonyl compounds
• Alternative Parents: Aniline and substituted anilines Sulfones Primary amines Organopnictogen compounds Organic oxides Hydrocarbon derivatives
• Molecular Framework: Aromatic homomonocyclic compounds
• Substituents: Benzenesulfonyl group - Aniline or substituted anilines - Sulfonyl - Sulfone - Organic nitrogen compound - Organic oxygen compound - Organopnictogen compound - Organic oxide - Hydrocarbon derivative - Primary amine - Organosulfur compound - Organonitrogen compound - Amine - Aromatic homomonocyclic compound
• Beschreibung: This compound belongs to the class of organic compounds known as benzenesulfonyl compounds. These are aromatic compounds containing a benzenesulfonyl group, which consists of a monocyclic benzene moiety that carries a sulfonyl group.
• External Descriptors: sulfone - substituted aniline

Data sources

1. Djoumbou Feunang Y, Eisner R, Knox C, Chepelev L, Hastings J, Owen G, Fahy E, Steinbeck C, Subramanian S, Bolton E, Greiner R, and Wishart DS. ClassyFire: Automated Chemical Classification With A Comprehensive, Computable Taxonomy. Journal of Cheminformatics, 2016, 8:61.

DOI: 10.1186/s13321-016-0174-y

Chemische und physikalische Eigenschaften

• Löslichkeit: Insoluble in water. Solubility in hot methanol is almost transparent. Soluble in DMSO, ethanol and acetone.
• Empfindlichkeit: Moisture sensitive；Light sensitive
• Schmelzpunkt (°C): 173-178°C