High Loading Spherical Alumina - Spheroidization rate ≥ 95%, water ≤ 0.05%, used for Thermal Interface Materials Alumina Ceramic Filter Thermal Spray Coating Thermal Engineering Plastics Thermally Conductive Aluminum-Based Copper Clad Laminate various ap

Cat. No.: H1525273

GRADE & PURITY Spheroidization rate ≥ 95%, water ≤ 0.05%

Storage

Room temperature

Shipped In

Normal

Übersicht

Product Model	D10 (μm)	D50 (μm)	D90 (μm)	Specific Surface Area (m²/g)	Electrical Conductivity (μS/cm)	pH Value	Moisture Content (%)	True Density (g/cm³)	Spheroidization Rate (%)	Whiteness
H1525273-B5μm	2.93	6.03	15.62	0.38	1.65	7.01	0.02	3.72	96	98.52
H1525273-B10μm	4.39	10.07	23.84	0.28	3.09	7.02	0.03	3.7	96	94.95
H1525273-B20μm	9.86	19.56	44.83	0.17	3.76	7.54	0.02	3.79	96	97.45
H1525273-B40μm	26.16	50.34	83.11	0.13	2.18	7.14	0.02	3.82	96	96.37
H1525273-B70μm	45.08	77.34	117.5	0.1	1.96	7.63	0.03	3.81	95	90.25
H1525273-B90μm	62.03	96.32	144.6	0.07	2.56	7.34	0.03	3.85	95	89.84
H1525273-B120μm	88.04	119.2	159.8	0.05	3.78	7.14	0.03	3.88	95	88.08
H1525273-A40μm	25.94	49.22	82.67	0.12	31.76	8.39	0.04	3.83	95.5	92.73
H1525273-A70μm	43.31	75.48	119	0.1	25.59	8.62	0.03	3.81	95.1	88.67
H1525273-A90μm	64.76	98.4	144.2	0.07	46.34	8.36	0.03	3.85	95.1	88.84
H1525273-A120μm	84.83	117.68	159.9	0.05	44.89	8.76	0.03	3.88	95.2	84.53

Key Features:

High spheroidization rate

High filling/High loading

High thermal conductivity

Wide particle size distribution

Specifications

Spezifikationen & Reinheit

Spheroidization rate ≥ 95%, water ≤ 0.05%

Anmeldung

Thermal Interface Materials Alumina Ceramic Filter Thermal Spray Coating Thermal Engineering Plastics Thermally Conductive Aluminum-Based Copper Clad Laminate

Storage

Room temperature

Verschickt in

Normal