Copper - ≥99.9% metals basis, ≥325 mesh , CAS No.7440-50-8

CAS: 7440-50-8 Cat. No.: C131632 Summenformel: Cu Molekulargewicht: 63.55 Beilstein Registry Number: MFCD00010965 EG-Nummer: 231-159-6

QUALITÄT & REINHEIT ≥99.9% metals basis, ≥325 mesh

Synonyms

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Storage

Room temperature,Argon charged,Desiccated

Shipped In

Normal

Spezifikationen

Synonyme

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Spezifikationen & Reinheit

≥99.9% metals basis, ≥325 mesh

Storage

Room temperature,Argon charged,Desiccated

Verschickt in

Normal

Reinheit

≥99.9% metals basis

Namen und Kennungen

Pubchem Sid

508816919

Pubchem Sid Url

https://pubchem.ncbi.nlm.nih.gov/substance/508816919

Isomere SMILES

[Cu]

WGK Deutschland

3

RTECS

GL5325000

UN-Nummer

UN 3189

Verpackungsgruppe

II

Molekulargewicht

63.55

Beilstein

MFCD00010965

Chemische und physikalische Eigenschaften

• Empfindlichkeit: Moisture sensitive；Air sensitive
• Siedepunkt (°C): 2567 °C (lit.)
• Schmelzpunkt (°C): 1083.4 °C (lit.)
• Molekulargewicht: 63.550 g/mol
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 0
• Rotatable Bond Count: 0
• Exact Mass: 62.9296 Da
• Monoisotopic Mass: 62.9296 Da
• Topological Polar Surface Area: 0.000 Ų
• Heavy Atom Count: 1
• Formal Charge: 0
• Complexity: 0.000
• Isotope Atom Count: 0
• Defined Atom Stereocenter Count: 0
• Undefined Atom Stereocenter Count: 0
• Defined Bond Stereocenter Count: 0
• Undefined Bond Stereocenter Count: 0
• The total count of all stereochemical bonds: 0
• Covalently-Bonded Unit Count: 1

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