Copper - ≥99.8%(complexometric), foil , CAS No.7440-50-8

CAS: 7440-50-8 Cat. No.: C434791 Summenformel: Cu Molekulargewicht: 63.55 Beilstein Registry Number: MFCD00010965 EG-Nummer: 231-159-6

GRADE & PURITY ≥99.8%(complexometric), foil

Synonyms

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Storage

Room temperature,Desiccated

Shipped In

Normal

Specifications

Synonyme

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Spezifikationen & Reinheit

≥99.8%(complexometric), foil

Storage

Room temperature,Desiccated

Verschickt in

Normal

Reinheit

≥99.8%(complexometric)

Namen und Kennungen

Kanonisches Lächeln

[Cu]

IUPAC Name

copper

InChIKey

RYGMFSIKBFXOCR-UHFFFAOYSA-N

INCHI

1S/Cu

Isomere SMILES

[Cu]

WGK Deutschland

3

RTECS

GL5325000

UN-Nummer

UN 3189

Verpackungsgruppe

II

Molekulargewicht

63.55

Beilstein

MFCD00010965

Taxonomic Classification

Taxonomy Tree

• Kingdom Inorganic compounds
  • Superclass Homogeneous metal compounds
    • Klasse Homogeneous transition metal compounds

• Kingdom: Inorganic compounds
• Superclass: Homogeneous metal compounds
• Klasse: Homogeneous transition metal compounds
• Subclass: Not available
• Intermediate Tree Nodes: Not available
• Direct Parent: Homogeneous transition metal compounds
• Alternative Parents: Not available
• Molecular Framework: Not available
• Substituents: Homogeneous transition metal
• Beschreibung: This compound belongs to the class of inorganic compounds known as homogeneous transition metal compounds. These are inorganic compounds containing only metal atoms,with the largest atom being a transition metal atom.
• External Descriptors: elemental copper

Data sources

1. Djoumbou Feunang Y, Eisner R, Knox C, Chepelev L, Hastings J, Owen G, Fahy E, Steinbeck C, Subramanian S, Bolton E, Greiner R, and Wishart DS. ClassyFire: Automated Chemical Classification With A Comprehensive, Computable Taxonomy. Journal of Cheminformatics, 2016, 8:61.

DOI: 10.1186/s13321-016-0174-y

Chemische und physikalische Eigenschaften

• Siedepunkt (°C): 2567 °C (lit.)
• Schmelzpunkt (°C): 1083.4 °C (lit.)
• Molekulargewicht: 63.550 g/mol
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 0
• Rotatable Bond Count: 0
• Exact Mass: 62.9296 Da
• Monoisotopic Mass: 62.9296 Da
• Topological Polar Surface Area: 0.000 Ų
• Heavy Atom Count: 1
• Formal Charge: 0
• Complexity: 0.000
• Isotope Atom Count: 0
• Defined Atom Stereocenter Count: 0
• Undefined Atom Stereocenter Count: 0
• Defined Bond Stereocenter Count: 0
• Undefined Bond Stereocenter Count: 0
• The total count of all stereochemical bonds: 0
• Covalently-Bonded Unit Count: 1

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