Aluminum Etchant Type F

Cat. No.: A487590
AVAILABLE TO ORDER
Synonyms
Aluminum etching solution for Al and Al-Si metallization
Storage
Room temperature
Shipped In
Normal
 ·  off list, applied to all prices below.
Size
Status
Price
Qty
100ml
A487590-100ml
8-12 wks(?) Production requires sourcing of materials. We appreciate your patience and understanding.
$79.90
500ml
A487590-500ml
8-12 wks(?) Production requires sourcing of materials. We appreciate your patience and understanding.

$139.90

$259.90
Save $120.00 (46.17%)
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Why this grade

for sensitive chromatographic and analytical workflows requiring minimal baseline interference.

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Storage & shipping

Room temperature Ships Normal Check lot-specific COA for exact specifications.

📋

Quality documents

SDS, COA, datasheet, and spec sheet available for download. Lot-specific COA accessible via lot number lookup.

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Literature proof

Cited in 0 peer-reviewed publications across chromatography, organic synthesis, and cross-coupling reactions.

Overview

Aluminum Etchant Type F is a stable preparation used to etch aluminum or aluminum-silicon metallizations on silicon devices and in integrated circuit applications. Aluminum contacts are defined and interconnections are formed. Aluminum Etchant Type F is formulated with unique properties easily overcome many of the difficulties experienced in aluminum etch processes such as residue. The aluminum metallization and etching process using photo-lithographic techniques is basic to the semiconductor and microelectronic technology.The Aluminum Etchant Type F is highly compatible with many of commercial photoresists and permit delineation into high resolution patterns. Metal line width of 1 mil and separations less than 5 microns are feasible. The high resolution is practical with the Aluminum Etchant Type F because lifting of photoresist patterns does not occur and undercutting is minimized.Aluminum Etchant Type F should not be used or stored in glass or Pyrex containers.Aluminum metallizations up to 25,000 A are vacuum deposited on the silicon slice, coated with a photoresist, and UV exposed using an appropriate photographic mask. The resist is developed to protect the aluminum where interconnections are desired. Then the unprotected areas of the aluminum are removed by etching with the Aluminum Etchant Type F, followed by a water rinse.Etching time is dependent upon the etchant temperature and the aluminum film thickness. When etching thick aluminum films, a higher etch rate is required; thus a higher etchant temperature should be used. Likewise, for thinner aluminum films, slower etch rates are desired and a lower etchant temperature should be chosen.At a specific etchant temperature, the etching time is given by the following formula:Etching time (second) + Film Thickness (Å)/ Etch Rate (Å/sec)where Etch Rate at 25°C 30 Å/sec; at 40°C 80 Å/sec.

Specifications

Synonyms
Aluminum etching solution for Al and Al-Si metallization
Storage
Room temperature
Shipped In
Normal

Documentation

📋 Safety Data Sheet (SDS)

Comprehensive hazard, handling, storage, and regulatory compliance document.

Download SDS →

✅ Certificate of Analysis (COA)

Lot-specific quality data. Enter your lot number to retrieve the exact COA.

Look up COA →

📊 Datasheet

Quick-reference summary of product specifications and applications.

View datasheet →

🔬 Specification Sheet

Full quality attributes and acceptance criteria for this grade.

View spec sheet →

Advanced Data

Certificates(CoA,COO,BSE/TSE and Analysis Chart)
C of A & Other Certificates(BSE/TSE, COO):
Analytical Chart:
Solution Calculators
Reviews

Customer Reviews

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