Copper - AR, ≥99.5% metals basis , CAS No.7440-50-8

CAS: 7440-50-8 Cat. No.: C103830 Summenformel: Cu Molekulargewicht: 63.55 Beilstein Registry Number: MFCD00010965 EG-Nummer: 231-159-6

QUALITÄT & REINHEIT AR, ≥99.5% metals basis

Synonyms

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Storage

Room temperature,Desiccated

Shipped In

Normal

Spezifikationen

Synonyme

Microheterogeneitycopper (Ii) Ion | Rame | Bronze powder | COPPER [MART.] | Pure copper, ERM(R) certified Reference Material, disc | 789U1901C5 | COPPER (MART.) | Copper foil, 0.1mm (0.004in) thick, Puratronic? | Copper, foil, thickness 0.05 mm, length 10

Spezifikationen & Reinheit

AR, ≥99.5% metals basis

Storage

Room temperature,Desiccated

Verschickt in

Normal

Note

AR

Reinheit

≥99.5% metals basis

Namen und Kennungen

Kanonisches Lächeln

[Cu]

IUPAC Name

copper

InChIKey

RYGMFSIKBFXOCR-UHFFFAOYSA-N

INCHI

1S/Cu

Isomere SMILES

[Cu]

WGK Deutschland

3

RTECS

GL5325000

UN-Nummer

UN 3189

Verpackungsgruppe

II

Molekulargewicht

63.55

Beilstein

MFCD00010965

Taxonomic Classification

Taxonomy Tree

• Kingdom Inorganic compounds
  • Superclass Homogeneous metal compounds
    • Klasse Homogeneous transition metal compounds

• Kingdom: Inorganic compounds
• Superclass: Homogeneous metal compounds
• Klasse: Homogeneous transition metal compounds
• Subclass: Not available
• Intermediate Tree Nodes: Not available
• Direct Parent: Homogeneous transition metal compounds
• Alternative Parents: Not available
• Molecular Framework: Not available
• Substituents: Homogeneous transition metal
• Beschreibung: This compound belongs to the class of inorganic compounds known as homogeneous transition metal compounds. These are inorganic compounds containing only metal atoms,with the largest atom being a transition metal atom.
• External Descriptors: elemental copper

Data sources

1. Djoumbou Feunang Y, Eisner R, Knox C, Chepelev L, Hastings J, Owen G, Fahy E, Steinbeck C, Subramanian S, Bolton E, Greiner R, and Wishart DS. ClassyFire: Automated Chemical Classification With A Comprehensive, Computable Taxonomy. Journal of Cheminformatics, 2016, 8:61.

DOI: 10.1186/s13321-016-0174-y

Chemische und physikalische Eigenschaften

• Empfindlichkeit: Moisture sensitive.
• Siedepunkt (°C): 2567 °C (lit.)
• Schmelzpunkt (°C): 1083.4 °C (lit.)
• Molekulargewicht: 63.550 g/mol
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 0
• Rotatable Bond Count: 0
• Exact Mass: 62.9296 Da
• Monoisotopic Mass: 62.9296 Da
• Topological Polar Surface Area: 0.000 Ų
• Heavy Atom Count: 1
• Formal Charge: 0
• Complexity: 0.000
• Isotope Atom Count: 0
• Defined Atom Stereocenter Count: 0
• Undefined Atom Stereocenter Count: 0
• Defined Bond Stereocenter Count: 0
• Undefined Bond Stereocenter Count: 0
• The total count of all stereochemical bonds: 0
• Covalently-Bonded Unit Count: 1

XLogP3

Häufig gestellte Fragen

How is this product shipped?

This product ships under standard ambient conditions. No temperature-controlled packaging is required.

What does the trace-metals specification mean?

This product is specified at ≥99.5% on a trace-metals basis. That figure describes metallic impurity content rather than overall chemical assay, so it is the relevant specification for ICP-MS, semiconductor and battery applications. Lot-specific values are stated on the Certificate of Analysis.

What does AR mean?

AR is a defined analytical purity tier suitable for general analytical and reagent applications. It specifies a minimum assay percentage, controlled limits on common impurities (water, heavy metals, residue on ignition), and lot-to-lot consistency. AR is one of several purity tiers — choose based on the sensitivity and regulatory requirements of your method.

How should this product be stored?

Store in a cool place, desiccated. Keep the container tightly closed with desiccant — the material is moisture-sensitive.

What are the CAS number, molecular formula and molecular weight?

The CAS Number is 7440-50-8, the molecular formula is Cu, and the molecular weight is 63.55 g/mol. InChIKey RYGMFSIKBFXOCR-UHFFFAOYSA-N.

What documentation is provided?

Available product documentation, including Certificates of Analysis (COA), Safety Data Sheets (SDS), and specification sheets, is shown in the product document area. Document availability and access follow the current site policy.