Disodium 3,3'-Dithiobis(1-propanesulfonate) - ≥95%(T) , CAS No.27206-35-5

CAS: 27206-35-5 Cat. No.: D154904 Molecular Weight: 354.38 EC Number: 248-324-3
AVAILABLE TO ORDER
GRADE & PURITY ≥95%(T)
Synonyms
D5159 | SCHEMBL2817 | SCHEMBL421602 | IWYDHOAUDWTVEP-ZETCQYMHSA-N | bis(sodium sulfopropyl)disulfide | Bis-(sodium sulfopropyl)-disulfide | sodium 3,3'-disulfanediyldipropane-1-sulfonate | FT-0653697 | Disodium 3,3'-Dithiobis(1-propanesulfonate) | W-10712
Storage
Room temperature
Shipped In
Normal
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Size
Status
Price
Qty
1g
D154904-1g
5
$9.90
5g
D154904-5g
5
$10.90
25g
D154904-25g
3

$17.90

$26.90
Save $9.00 (33.46%)
100g
D154904-100g
4

$59.90

$89.90
Save $30.00 (33.37%)
500g
D154904-500g
1

$84.90

$127.90
Save $43.00 (33.62%)
Enter a quantity for the sizes you want to add.
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Why this grade

≥95%(T) for sensitive chromatographic and analytical workflows requiring minimal baseline interference.

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Storage & shipping

Room temperature Ships Normal Check lot-specific COA for exact specifications.

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Quality documents

SDS, COA, datasheet, and spec sheet available for download. Lot-specific COA accessible via lot number lookup.

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Literature proof

Cited in 15 peer-reviewed publications across chromatography, organic synthesis, and cross-coupling reactions.

Specifications

Synonyms
D5159 | SCHEMBL2817 | SCHEMBL421602 | IWYDHOAUDWTVEP-ZETCQYMHSA-N | bis(sodium sulfopropyl)disulfide | Bis-(sodium sulfopropyl)-disulfide | sodium 3, 3'-disulfanediyldipropane-1-sulfonate | FT-0653697 | Disodium 3, 3'-Dithiobis(1-propanesulfonate) | W-10712
Specifications & Purity
≥95%(T)
Storage
Room temperature
Shipped In
Normal
Purity
≥95%(T)
Names and Identifiers
Pubchem Sid488187564
Pubchem Sid Urlhttps://pubchem.ncbi.nlm.nih.gov/substance/488187564
Canonical SmilesC(CSSCCCS(=O)(=O)[O-])CS(=O)(=O)[O-].[Na+].[Na+]
IUPAC Namedisodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate
InChIKeyWIYCQLLGDNXIBA-UHFFFAOYSA-L
INCHI1S/C6H14O6S4.2Na/c7-15(8,9)5-1-3-13-14-4-2-6-16(10,11)12;;/h1-6H2,(H,7,8,9)(H,10,11,12);;/q;2*+1/p-2
Isomeric SMILES C(CSSCCCS(=O)(=O)[O-])CS(=O)(=O)[O-].[Na+].[Na+]
Molecular Weight 354.38
Reaxy-Rn 21221558
Reaxys-RN_link_address https://www.reaxys.com/reaxys/secured/hopinto.do?context=S&query=IDE.XRN=21221558&ln=

Documentation

📋 Safety Data Sheet (SDS)

Comprehensive hazard, handling, storage, and regulatory compliance document.

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✅ Certificate of Analysis (COA)

Lot-specific quality data. Enter your lot number to retrieve the exact COA.

Look up COA →

📊 Datasheet

Quick-reference summary of product specifications and applications.

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🔬 Specification Sheet

Full quality attributes and acceptance criteria for this grade.

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Advanced Data

Taxonomic Classification

Taxonomy Tree

KingdomOrganic compounds
SuperclassOrganic acids and derivatives
ClassOrganic sulfonic acids and derivatives
SubclassOrganosulfonic acids and derivatives
Intermediate Tree Nodes Not available
Direct ParentOrganosulfonic acids
Alternative Parents Sulfonyls  Alkanesulfonic acids  Dialkyldisulfides  Sulfenyl compounds  Organic sodium salts  Organic oxides  Hydrocarbon derivatives  
Molecular FrameworkAliphatic acyclic compounds
Substituents Alkanesulfonic acid - Sulfonyl - Organosulfonic acid - Dialkyldisulfide - Organic disulfide - Organic alkali metal salt - Sulfenyl compound - Organic oxygen compound - Organic oxide - Hydrocarbon derivative - Organic sodium salt - Organic salt - Organosulfur compound - Aliphatic acyclic compound
DescriptionThis compound belongs to the class of organic compounds known as organosulfonic acids. These are compounds containing the sulfonic acid group, which has the general structure RS(=O)2OH (R is not a hydrogen atom).
External Descriptors Not available
3D Structure
Interactive Chemical Structure Model





Certificates(CoA,COO,BSE/TSE and Analysis Chart)
C of A & Other Certificates(BSE/TSE, COO):
Analytical Chart:

Find and download the COA for your product by matching the lot number on the packaging.

22 results found

Lot NumberCertificate TypeDateItem
G2215272Certificate of AnalysisApr 07, 2026 D154904
G2215310Certificate of AnalysisApr 07, 2026 D154904
K2105685Certificate of AnalysisAug 12, 2025 D154904
B2626158Certificate of AnalysisNov 26, 2024 D154904
L2411026Certificate of AnalysisNov 26, 2024 D154904
L2411025Certificate of AnalysisNov 26, 2024 D154904
L2411024Certificate of AnalysisNov 26, 2024 D154904
L2411020Certificate of AnalysisNov 26, 2024 D154904
L2404461Certificate of AnalysisNov 26, 2024 D154904
G2504108Certificate of AnalysisNov 26, 2024 D154904
D2613028Certificate of AnalysisNov 26, 2024 D154904
C2604014Certificate of AnalysisNov 26, 2024 D154904
I1920028Certificate of AnalysisJul 10, 2023 D154904
G2215311Certificate of AnalysisJun 11, 2022 D154904
G2215541Certificate of AnalysisJun 11, 2022 D154904
G2312030Certificate of AnalysisJun 11, 2022 D154904
G2215270Certificate of AnalysisJun 11, 2022 D154904
F2328168Certificate of AnalysisJun 11, 2022 D154904
K2301071Certificate of AnalysisJun 11, 2022 D154904
F2328163Certificate of AnalysisJun 11, 2022 D154904
F2328159Certificate of AnalysisJun 11, 2022 D154904
B2314031Certificate of AnalysisJun 11, 2022 D154904

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Chemical and Physical Properties
SolubilitySoluble in water
Molecular Weight354.400 g/mol
XLogP3
Hydrogen Bond Donor Count0
Hydrogen Bond Acceptor Count8
Rotatable Bond Count7
Exact Mass353.931 Da
Monoisotopic Mass353.931 Da
Topological Polar Surface Area182.000 Ų
Heavy Atom Count18
Formal Charge0
Complexity296.000
Isotope Atom Count0
Defined Atom Stereocenter Count0
Undefined Atom Stereocenter Count0
Defined Bond Stereocenter Count0
Undefined Bond Stereocenter Count0
The total count of all stereochemical bonds0
Covalently-Bonded Unit Count3
Citations of This Product
References
1. Huijuan Shi, Yunzhi Tang, Yuhui Tan, Zhen Sun.  (2023)  Quantitative analysis of organic additives in acid copper plating solution.  CHEMICAL PHYSICS LETTERS,      [PMID:] [10.1016/j.cplett.2023.140700]
2. Lei Jin, Zhao-Yun Wang, Zhuan-Yun Cai, Jia-Qiang Yang, An-Ni Zheng, Fang-Zu Yang, De-Yin Wu, Dongping Zhan.  (2023)  1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating.  JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY,      [PMID:] [10.1016/j.jiec.2023.05.036]
3. Lei Jin, An-Ni Zheng, Mei Wang, Jia-Qiang Yang, Zhao-Yun Wang, Fang-Zu Yang, De-Yin Wu, Dongping Zhan.  (2023)  Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection.  COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,      [PMID:] [10.1016/j.colsurfa.2023.131706]
4. Yichen Chen, Biao Ma, Yinxiu Zuo, Gangsheng Chen, Qing Hao, Chao Zhao, Hong Liu.  (2023)  Versatile sweat bioanalysis on demand with hydrogel-programmed wearables.  BIOSENSORS & BIOELECTRONICS,      [PMID:37236013] [10.1016/j.bios.2023.115412]
5. Xinwen Zhang, Ruoyun Wang, Fei Long, Tong Zhou, Wenbin Hu, Lei Liu.  (2021)  Durable superhydrophobic coating derived from hard-soft technology with enhanced anticorrosion performance.  CORROSION SCIENCE,      [PMID:] [10.1016/j.corsci.2021.109889]
6. Yicai Wu, Zijie Mao, Xianxian Qin, Kun Jiang, Xian-Yin Ma, Tian-Wen Jiang, Wen-Bin Cai.  (2024)  Decoding the suppressing effects of Pluronic triblock copolymers on copper electrodeposition.  JOURNAL OF COLLOID AND INTERFACE SCIENCE,      [PMID:39863347] [10.1016/j.jcis.2024.12.178]
7. Li Lanchen, Peng Xuesong, Jiang Jie, Li Ruopeng, Zhang Jinqiu, Yang Peixia, An Maozhong.  (2024)  Functional additives inhibit crystal growth to achieve low-roughness and high-peel strength of micro-coarsening copper foil.  IONICS,  30  (7): (4281-4295).  [PMID:] [10.1007/s11581-024-05566-6]
8. Ke Li, Qifei Xia, Lei Jin, Rongbin Xu, Yi Zhong, Daquan Yu.  (2024)  Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias.  COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,      [PMID:] [10.1016/j.colsurfa.2024.136007]
9. Tao Song, Zhao-Yun Wang, Jia-Qiang Yang, Yi Zhao, Fang-Zu Yang, Dongping Zhan.  (2024)  Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating.  JOURNAL OF ELECTROANALYTICAL CHEMISTRY,      [PMID:] [10.1016/j.jelechem.2024.118340]
10. Xiao Zhang, Xixun Shen, Runlin Wang, Zihao Zhang, Wei Huang, Qunjie Xu, Zhenni Kang, Junfeng He.  (2025)  Polypyrrole conductive film formed by in-situ polymerization as a conductive seed layer for hole metallization of printed circuit boards and blind hole electroplating filling behavior.  POLYMER,      [PMID:] [10.1016/j.polymer.2025.129140]
11. Tao Song, Jun-Yi Wang, Jiang-Peng Qiu, Jia-Qiang Yang, Zhao-Yun Wang, Yi Zhao, Xiao-Hui Yang, Ren Hu, Jun Cheng, Fang-Zu Yang, Lian-Huan Han, Dong-Ping Zhan.  (2025)  Synthesis of Quaternary Ammonium Gemini Levelers and Their Action Mechanisms in Microvias Void-Free Copper Filling.  Colloids and Interfaces,  (5): (62).  [PMID:] [10.3390/colloids9050062]
12. Yi Zhao, Juxing Zeng, Jia-Qiang Yang, Tao Song, Ren Hu, Jian-Jia Su, Bo Zhang, Fang-Zu Yang, Dongping Zhan, Lianhuan Han.  (2025)  On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation.  Industrial Chemistry & Materials,      [PMID:] [10.1039/D5IM00073D]
13. Zhao-Yun Wang, Li-Xin Yu, Yu-Qing Feng, Lei Jin, Jia-Qiang Yang, Yi Zhao, Tao Song, DongPing Zhan, Daquan Yu, Fang-Zu Yang, Shi-Gang Sun.  (2025)  Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling.  ACS Applied Materials & Interfaces,      [PMID:40262106] [10.1021/acsami.5c04034]
14. Peng Sun, Xiao Zhang, Xixun Shen, Runlin Wang, Zihao Zhang, Zhenni Kang, Junfeng He, Qunjie Xu.  (2025)  Polyaniline graphene composite conductive film formed by in-situ polymerization combined with the self-assembly method as a conductive seed layer for printed circuit board hole metallization.  APPLIED SURFACE SCIENCE,      [PMID:] [10.1016/j.apsusc.2025.165230]
15. Youchi Chen, Shuzhou Xing, Jie Jiang, Ruopeng Li, Yaqiang Li, Xin Li, Mingjie Li, Maozhong An, Jinqiu Zhang, Jiang Qin, Peixia Yang.  (2025)  Deciphering the Role of Chromotrope 2R in Conformal Copper Electrodeposition and Microstructural Control for PCB Through-Hole Metallization.  ELECTROCHIMICA ACTA,      [PMID:] [10.1016/j.electacta.2025.148106]
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