Copper(II) formate tetrahydrate - ≥98% , CAS No.5893-61-8

CAS: 5893-61-8 Cat. No.: C304074 Molecular Weight: 225.65 EC Number: 679-288-0

GRADE & PURITY ≥98%

Synonyms

Copper(2+) formate tetrahydrate | V7RA28204J | COPPER(II) FORMATE TETRAHYDRATE | SY315224 | copper;diformate;tetrahydrate | copper diformate tetrahydrate | LSIWWRSSSOYIMS-UHFFFAOYSA-L | Cupric formate tetrahydrate | AKOS025295499 | Cupric formate tetrahyd

Storage

Room temperature,Desiccated

Shipped In

Normal

Overview

It is employed as an antibacterial agent in the treatment of cellulose

Specifications

Synonyms

Copper(2+) formate tetrahydrate | V7RA28204J | COPPER(II) FORMATE TETRAHYDRATE | SY315224 | copper;diformate;tetrahydrate | copper diformate tetrahydrate | LSIWWRSSSOYIMS-UHFFFAOYSA-L | Cupric formate tetrahydrate | AKOS025295499 | Cupric formate tetrahyd

Specifications & Purity

≥98%

Storage

Room temperature, Desiccated

Shipped In

Normal

Purity

≥98%

Names and Identifiers

• Pubchem Sid: 488195768
• Pubchem Sid Url: https://pubchem.ncbi.nlm.nih.gov/substance/488195768
• Canonical Smiles: C(=O)[O-].C(=O)[O-].O.O.O.O.[Cu+2]
• IUPAC Name: copper;diformate;tetrahydrate
• InChIKey: LSIWWRSSSOYIMS-UHFFFAOYSA-L
• INCHI: 1S/2CH2O2.Cu.4H2O/c2*2-1-3;;;;;/h2*1H,(H,2,3);;4*1H2/q;;+2;;;;/p-2
• Isomeric SMILES: C(=O)[O-].C(=O)[O-].O.O.O.O.[Cu+2]
• Alternate CAS: 544-19-4
• UN Number: 3077
• Packing Group: III
• Molecular Weight: 225.65
• Reaxy-Rn: 3724531
• Reaxys-RN_link_address: https://www.reaxys.com/reaxys/secured/hopinto.do?context=S&query=IDE.XRN=3724531&ln=

Taxonomic Classification

Taxonomy Tree

• Kingdom Organic compounds
  • Superclass Organic acids and derivatives
    • Class Carboxylic acids and derivatives
      • Subclass Carboxylic acid derivatives

• Kingdom: Organic compounds
• Superclass: Organic acids and derivatives
• Class: Carboxylic acids and derivatives
• Subclass: Carboxylic acid derivatives
• Intermediate Tree Nodes: Not available
• Direct Parent: Carboxylic acid salts
• Alternative Parents: Monocarboxylic acids and derivatives Carboxylic acids Organic oxides Organic copper salts Hydrocarbon derivatives Carbonyl compounds Organic cations
• Molecular Framework: Not available
• Substituents: Carboxylic acid salt - Organic transition metal salt - Monocarboxylic acid or derivatives - Carboxylic acid - Organic oxygen compound - Organic oxide - Hydrocarbon derivative - Organic copper salt - Organic salt - Organooxygen compound - Carbonyl group - Organic cation - Aliphatic acyclic compound
• Description: This compound belongs to the class of organic compounds known as carboxylic acid salts. These are ionic derivatives of carboxylic acid.
• External Descriptors: Not available

Data sources

1. Djoumbou Feunang Y, Eisner R, Knox C, Chepelev L, Hastings J, Owen G, Fahy E, Steinbeck C, Subramanian S, Bolton E, Greiner R, and Wishart DS. ClassyFire: Automated Chemical Classification With A Comprehensive, Computable Taxonomy. Journal of Cheminformatics, 2016, 8:61.

DOI: 10.1186/s13321-016-0174-y

Chemical and Physical Properties

• Solubility: Soluble in water (125 g/L at 20°C). Very slightly soluble in alcohol. Practically insoluble in most organic solvents.
• Molecular Weight: 225.640 g/mol
• Hydrogen Bond Donor Count: 4
• Hydrogen Bond Acceptor Count: 8
• Rotatable Bond Count: 0
• Exact Mass: 224.967 Da
• Monoisotopic Mass: 224.967 Da
• Topological Polar Surface Area: 84.300 Ų
• Heavy Atom Count: 11
• Formal Charge: 0
• Complexity: 7.500
• Isotope Atom Count: 0
• Defined Atom Stereocenter Count: 0
• Undefined Atom Stereocenter Count: 0
• Defined Bond Stereocenter Count: 0
• Undefined Bond Stereocenter Count: 0
• The total count of all stereochemical bonds: 0
• Covalently-Bonded Unit Count: 7

XLogP3

References

1. Jianbo Xin, Yue Gao, Chenghao Zhang, Le Yang, Sushi Liu, Ke Li, Minghao Zhou, Yang Liu, Jing Zhang, William Cai.  (2024)  High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures.  JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,      [PMID:] [10.1016/j.jmatprotec.2024.118435]

2. Peilin Cui, Yunxie Huang, Runkeng Liu, Dinghua Hu, Huiying Wu, Zhenyu Liu.  (2025)  Three-Tier Hierarchical Porous Structure with Ultrafast Capillary Transport for Flexible Electronics Cooling.  ACS Applied Materials & Interfaces,      [PMID:39927793] [10.1021/acsami.4c16929]

3. Yunfan Wang, Xuebin Liu, Junhua Huang, Shaodian Yang, Baohua Li, Weiqiang Huang, Zhiping Zeng, Yougen Hu, Xuchun Gui.  (2025)  Flexible, Conductive Cu@CNT Films for Ultra-Broadband Electromagnetic Interference Shielding and Low-voltage Electrothermal Heating.  Journal of Materials Chemistry C,      [PMID:] [10.1039/D5TC01729G]

4. Juan Du, Jiaren Zhang, Yong Sun, Wenlong Jia, Zhihao Si, He Gao, Xing Tang, Xianhai Zeng, Tingzhou Lei, Shijie Liu, Lu Lin.  (2018)  Catalytic transfer hydrogenation of biomass-derived furfural to furfuryl alcohol over in-situ prepared nano Cu-Pd/C catalyst using formic acid as hydrogen source.  JOURNAL OF CATALYSIS,      [PMID:] [10.1016/j.jcat.2018.09.025]

5. Bin Lei, Xiao Liu, Bo Li, Haolin Lu, Xing-Yue He, Xiaowen Wang, Guankui Long, Jian-Gong Ma, Peng Cheng.  (2025)  Controllable partial self-sacrifice of metal-organic frameworks for enhancing nitrate electroreduction to ammonia.  Chem Catalysis,      [PMID:] [10.1016/j.checat.2025.101484]

6. Xiaoxue Zhang, Niu Liu, Zhen-Feng Huang, Ru Jia, Lun Pan, Chengxiang Shi, Xiangwen Zhang, Guidong Yang, Ji-Jun Zou.  (2026)  Tip-Enhanced Electric Fields on Dendritic Copper Accelerate Water Dissociation for Selective Nitrate-To-Ammonia Electroreduction.  ACS Sustainable Chemistry & Engineering,      [PMID:] [10.1021/acssuschemeng.6c01209]