Determine the necessary mass, volume, or concentration for preparing a solution.
≥95%(T) for sensitive chromatographic and analytical workflows requiring minimal baseline interference.
Room temperature Ships Normal Check lot-specific COA for exact specifications.
SDS, COA, datasheet, and spec sheet available for download. Lot-specific COA accessible via lot number lookup.
Cited in 15 peer-reviewed publications across chromatography, organic synthesis, and cross-coupling reactions.
| Pubchem Sid | 488187564 |
|---|---|
| Pubchem Sid Url | https://pubchem.ncbi.nlm.nih.gov/substance/488187564 |
| Canonical Smiles | C(CSSCCCS(=O)(=O)[O-])CS(=O)(=O)[O-].[Na+].[Na+] |
| IUPAC Name | disodium;3-(3-sulfonatopropyldisulfanyl)propane-1-sulfonate |
| InChIKey | WIYCQLLGDNXIBA-UHFFFAOYSA-L |
| INCHI | 1S/C6H14O6S4.2Na/c7-15(8,9)5-1-3-13-14-4-2-6-16(10,11)12;;/h1-6H2,(H,7,8,9)(H,10,11,12);;/q;2*+1/p-2 |
| Isomeric SMILES | C(CSSCCCS(=O)(=O)[O-])CS(=O)(=O)[O-].[Na+].[Na+] |
| Molecular Weight | 354.38 |
| Reaxy-Rn | 21221558 |
| Reaxys-RN_link_address | https://www.reaxys.com/reaxys/secured/hopinto.do?context=S&query=IDE.XRN=21221558&ln= |
Comprehensive hazard, handling, storage, and regulatory compliance document.
Download SDS →Lot-specific quality data. Enter your lot number to retrieve the exact COA.
Look up COA →Full quality attributes and acceptance criteria for this grade.
View spec sheet →Taxonomy Tree
| Kingdom | Organic compounds |
|---|---|
| Superclass | Organic acids and derivatives |
| Class | Organic sulfonic acids and derivatives |
| Subclass | Organosulfonic acids and derivatives |
| Intermediate Tree Nodes | Not available |
| Direct Parent | Organosulfonic acids |
| Alternative Parents | Sulfonyls Alkanesulfonic acids Dialkyldisulfides Sulfenyl compounds Organic sodium salts Organic oxides Hydrocarbon derivatives |
| Molecular Framework | Aliphatic acyclic compounds |
| Substituents | Alkanesulfonic acid - Sulfonyl - Organosulfonic acid - Dialkyldisulfide - Organic disulfide - Organic alkali metal salt - Sulfenyl compound - Organic oxygen compound - Organic oxide - Hydrocarbon derivative - Organic sodium salt - Organic salt - Organosulfur compound - Aliphatic acyclic compound |
| Description | This compound belongs to the class of organic compounds known as organosulfonic acids. These are compounds containing the sulfonic acid group, which has the general structure RS(=O)2OH (R is not a hydrogen atom). |
| External Descriptors | Not available |
Find and download the COA for your product by matching the lot number on the packaging.
| Lot Number | Certificate Type | Date | Item |
|---|---|---|---|
| Certificate of Analysis | Apr 07, 2026 | D154904 | |
| Certificate of Analysis | Apr 07, 2026 | D154904 | |
| Certificate of Analysis | Aug 12, 2025 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Nov 26, 2024 | D154904 | |
| Certificate of Analysis | Jul 10, 2023 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 | |
| Certificate of Analysis | Jun 11, 2022 | D154904 |
| Solubility | Soluble in water |
|---|---|
| Molecular Weight | 354.400 g/mol |
| XLogP3 | |
| Hydrogen Bond Donor Count | 0 |
| Hydrogen Bond Acceptor Count | 8 |
| Rotatable Bond Count | 7 |
| Exact Mass | 353.931 Da |
| Monoisotopic Mass | 353.931 Da |
| Topological Polar Surface Area | 182.000 Ų |
| Heavy Atom Count | 18 |
| Formal Charge | 0 |
| Complexity | 296.000 |
| Isotope Atom Count | 0 |
| Defined Atom Stereocenter Count | 0 |
| Undefined Atom Stereocenter Count | 0 |
| Defined Bond Stereocenter Count | 0 |
| Undefined Bond Stereocenter Count | 0 |
| The total count of all stereochemical bonds | 0 |
| Covalently-Bonded Unit Count | 3 |
| 1. Huijuan Shi, Yunzhi Tang, Yuhui Tan, Zhen Sun. (2023) Quantitative analysis of organic additives in acid copper plating solution. CHEMICAL PHYSICS LETTERS, [PMID:] [10.1016/j.cplett.2023.140700] |
| 2. Lei Jin, Zhao-Yun Wang, Zhuan-Yun Cai, Jia-Qiang Yang, An-Ni Zheng, Fang-Zu Yang, De-Yin Wu, Dongping Zhan. (2023) 1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating. JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, [PMID:] [10.1016/j.jiec.2023.05.036] |
| 3. Lei Jin, An-Ni Zheng, Mei Wang, Jia-Qiang Yang, Zhao-Yun Wang, Fang-Zu Yang, De-Yin Wu, Dongping Zhan. (2023) Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, [PMID:] [10.1016/j.colsurfa.2023.131706] |
| 4. Yichen Chen, Biao Ma, Yinxiu Zuo, Gangsheng Chen, Qing Hao, Chao Zhao, Hong Liu. (2023) Versatile sweat bioanalysis on demand with hydrogel-programmed wearables. BIOSENSORS & BIOELECTRONICS, [PMID:37236013] [10.1016/j.bios.2023.115412] |
| 5. Xinwen Zhang, Ruoyun Wang, Fei Long, Tong Zhou, Wenbin Hu, Lei Liu. (2021) Durable superhydrophobic coating derived from hard-soft technology with enhanced anticorrosion performance. CORROSION SCIENCE, [PMID:] [10.1016/j.corsci.2021.109889] |
| 6. Yicai Wu, Zijie Mao, Xianxian Qin, Kun Jiang, Xian-Yin Ma, Tian-Wen Jiang, Wen-Bin Cai. (2024) Decoding the suppressing effects of Pluronic triblock copolymers on copper electrodeposition. JOURNAL OF COLLOID AND INTERFACE SCIENCE, [PMID:39863347] [10.1016/j.jcis.2024.12.178] |
| 7. Li Lanchen, Peng Xuesong, Jiang Jie, Li Ruopeng, Zhang Jinqiu, Yang Peixia, An Maozhong. (2024) Functional additives inhibit crystal growth to achieve low-roughness and high-peel strength of micro-coarsening copper foil. IONICS, 30 (7): (4281-4295). [PMID:] [10.1007/s11581-024-05566-6] |
| 8. Ke Li, Qifei Xia, Lei Jin, Rongbin Xu, Yi Zhong, Daquan Yu. (2024) Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias. COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, [PMID:] [10.1016/j.colsurfa.2024.136007] |
| 9. Tao Song, Zhao-Yun Wang, Jia-Qiang Yang, Yi Zhao, Fang-Zu Yang, Dongping Zhan. (2024) Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, [PMID:] [10.1016/j.jelechem.2024.118340] |
| 10. Xiao Zhang, Xixun Shen, Runlin Wang, Zihao Zhang, Wei Huang, Qunjie Xu, Zhenni Kang, Junfeng He. (2025) Polypyrrole conductive film formed by in-situ polymerization as a conductive seed layer for hole metallization of printed circuit boards and blind hole electroplating filling behavior. POLYMER, [PMID:] [10.1016/j.polymer.2025.129140] |
| 11. Tao Song, Jun-Yi Wang, Jiang-Peng Qiu, Jia-Qiang Yang, Zhao-Yun Wang, Yi Zhao, Xiao-Hui Yang, Ren Hu, Jun Cheng, Fang-Zu Yang, Lian-Huan Han, Dong-Ping Zhan. (2025) Synthesis of Quaternary Ammonium Gemini Levelers and Their Action Mechanisms in Microvias Void-Free Copper Filling. Colloids and Interfaces, 9 (5): (62). [PMID:] [10.3390/colloids9050062] |
| 12. Yi Zhao, Juxing Zeng, Jia-Qiang Yang, Tao Song, Ren Hu, Jian-Jia Su, Bo Zhang, Fang-Zu Yang, Dongping Zhan, Lianhuan Han. (2025) On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation. Industrial Chemistry & Materials, [PMID:] [10.1039/D5IM00073D] |
| 13. Zhao-Yun Wang, Li-Xin Yu, Yu-Qing Feng, Lei Jin, Jia-Qiang Yang, Yi Zhao, Tao Song, DongPing Zhan, Daquan Yu, Fang-Zu Yang, Shi-Gang Sun. (2025) Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling. ACS Applied Materials & Interfaces, [PMID:40262106] [10.1021/acsami.5c04034] |
| 14. Peng Sun, Xiao Zhang, Xixun Shen, Runlin Wang, Zihao Zhang, Zhenni Kang, Junfeng He, Qunjie Xu. (2025) Polyaniline graphene composite conductive film formed by in-situ polymerization combined with the self-assembly method as a conductive seed layer for printed circuit board hole metallization. APPLIED SURFACE SCIENCE, [PMID:] [10.1016/j.apsusc.2025.165230] |
| 15. Youchi Chen, Shuzhou Xing, Jie Jiang, Ruopeng Li, Yaqiang Li, Xin Li, Mingjie Li, Maozhong An, Jinqiu Zhang, Jiang Qin, Peixia Yang. (2025) Deciphering the Role of Chromotrope 2R in Conformal Copper Electrodeposition and Microstructural Control for PCB Through-Hole Metallization. ELECTROCHIMICA ACTA, [PMID:] [10.1016/j.electacta.2025.148106] |